Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Hao Cui.
Proceedings of the 2018 Joint International Advanced Engineering and Technology Research Conference (JIAET 2018) | 2018
Manmen Liu; Jialin Chen; Hao Cui; Xudong Sun; Shaohong Liu; Ming Xie; Xiaoli Zhu
A novel environmental-friendly Cu-Sn high temperature solder paste was fabricated by mixing Cu powder, Sn powder and commercial purchased flux. Different type and content of the flux may significantly affect the thermal properties of the solder paste. The bonding layer was composed of compact Cu3Sn and loose Cu6Sn5. The thickness of the Cu3Sn layer increased with the extension of the bonding time. The high temperature (at 300°C) shear strength of the bonding layer bonded under pressure of 10MPa was 23 MPa.
Archive | 2010
Yusheng Li; Hao Cui; Ming Xie; Yongtai Chen; Youcai Yang; Libin Zhang; Jinghua Li; Manmen Liu
Archive | 2010
Yongtai Chen; Ming Xie; Youcai Yang; Jiming Zhang; Hao Cui; Manmen Liu
Archive | 2012
Ming Xie; Youcai Yang; Yongtai Chen; Manmen Liu; Jiming Zhang; Song Chen; Saibei Wang; Jieqiong Hu; Yunfeng Yang; Hao Cui; Song Wang
Archive | 2012
Ming Xie; Youcai Yang; Yongtai Chen; Hao Cui; Manmen Liu; Jiming Zhang; Song Chen; Jiuzhou Zhao; Jingchao Chen
Archive | 2012
Ming Xie; Yongtai Chen; Manmen Liu; Jiming Zhang; Youcai Yang; Song Chen; Saibei Wang; Jieqiong Hu; Hao Cui; Song Wang
Archive | 2011
Hao Cui; Ming Xie; Youcai Yang; Jianwen Kong; Yongtai Chen; Manmen Liu; Jinghua Li; Jiming Zhang; Libin Zhang
Materials Letters | 2018
Manmen Liu; Jialin Chen; Hao Cui; Xudong Sun; Shaohong Liu; Ming Xie
Archive | 2011
Ming Xie; Youcai Yang; Manmen Liu; Jiming Zhang; Yongtai Chen; Hao Cui; Song Chen
Archive | 2010
Ming Xie; Rongsheng Huang; Douzuo Tang; Xingwang Yao; Hao Cui; Xingcheng Song; Manmen Liu; Youcai Yang; Shengli Xu; Yongtai Chen
Collaboration
Dive into the Hao Cui's collaboration.
