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He Hu

Central South University

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Publication

Featured researches published by He Hu.

Microelectronic Engineering | 2009

The law of ultrasonic energy conversion in thermosonic flip chip bonding interfaces

Li Junhui; Wang Ruishan; He Hu; Wang Fuliang; Han Lei; Zhong Jue

Archive | 2017

Method and system for predicting equivalent thermal conductivity of TSV adapter plate

He Hu; Xiao Chengdi; Li Junhui; Cao Sen; Wang Yan; Chen Zhuo; Zhu Wenhui

Archive | 2017

Flexible loading testing device for microelectronic device

Li Laxiangge; Li Junhui; Liu Xiaohe; He Hu; Zhu Wenhui; Peng Qifa

Archive | 2017

Fine-pitch single IC chip packaging part and preparation method therefor

Zhu Wenhui; Yang Hui; Li Junhui; He Hu; Chen Zhuo

Microelectronics Reliability | 2017

3D ICパッケージングのためのTSV熱挙動に与える寸法パラメータと欠陥の影響【Powered by NICT】

Pan Yuanxing; Li Fei; He Hu; Li Junhui; Zhu Wenhui

Microelectronic Engineering | 2017

添加した(TSV)Si貫通ビアの銅電着の数値モデル化と実験的検証【Powered by NICT】

Xiao Hongbin; He Hu; Ren Xinyu; Zeng Peng; Wang Fuliang

Archive | 2016

Hot ultrasonic sintering method and device of nano silver/graphene composite ink

Wang Fuliang; Zhu Haixin; He Hu; Li Junhui; Zhu Wenhui

Archive | 2016

High-power LED radiating system and control method thereof

Li Junhui; Xiao Chengdi; Liao Hailong; He Hu; Chen Zhuo; Zhu Wenhui

Archive | 2016

Inter-micro-copper-cylinder copper-copper direct thermosonic flip-chip bonding method and apparatus

Wang Fuliang; Chen Zhuo; He Hu; Li Junhui; Zhu Wenhui

IEEE Conference Proceedings | 2016

Investigation on the defect induced thermal mechanical stress for TSV

Li Fei; Xiao Chengdi; He Hu; Li Junhui; Zhu Wenhui

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Collaboration

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Li Junhui

Central South University

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Wang Fuliang

Central South University

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Han Lei

Central South University

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Wang Ruishan

Central South University

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Zhong Jue

Central South University

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