Heiko Gulan

Coplanar 122-GHz Antenna Array With Air Cavity Reflector for Integration in Plastic Packages

This letter introduces the concept of a surface-mountable millimeter-wave radar sensor, which becomes possible by integrating the complete radar front end including the antennas into a single plastic package. The packaging concept is based on a matched coplanar wire-bond interconnect between the semiconductor die and the off-chip antenna. A 122-GHz antenna design is presented that uses an air cavity within the center die pad to improve the bandwidth-efficiency product. The antenna is designed in an array configuration to reduce the effect of surface waves. Measurements of the antenna prototype in the package, as well as a study on the influence of the package lid on the antenna performance, are given.

Integrated 122-GHz Antenna on a Flexible Polyimide Substrate With Flip Chip Interconnect

A packaging solution for the integration of an MMIC and a thin film antenna into a single surface-mountable package is presented. It is based on an air cavity in the package base into which the MMIC is placed. All package-to-MMIC interconnects are routed through the antenna substrate and all connections are realized using flip chip technology. Thus wire bonds are eliminated within the whole package. A broadband flip chip interconnect is used to connect MMIC and antenna. As the antenna is situated above an air cavity, a large bandwidth is also achieved for the antenna. An antenna-in-package prototype is presented to demonstrate the feasibility of the assembly process and to test the antenna performance including the flip chip interconnect. The influence of an additional package cover is analyzed by measuring the antenna covered with two different lids.

Probe based antenna measurements up to 325 GHz for upcoming millimeter-wave applications

In this paper a probe based measurement setup is presented that allows the characterization of antennas in the frequency-range between 220 GHz and 325 GHz. The radiation pattern, as well as the gain and the return loss of the antenna under test (AUT) can be measured. The limits of the system in terms of accuracy and dynamic range are given. To demonstrate its functionality a 240 GHz patch-antenna on Gallium Arsenide (GaAs) substrate is measured. A comparison between simulation and measurement shows very good agreement.

122-GHz chip-to-antenna wire bond interconnect with high repeatability

This paper presents a 122-GHz chip-to-antenna wire bond interconnect for low-cost, fully integrated transceivers. It is based on the standard ball-stitch bond technology and uses planar transmission lines for matching. A study on the effects of process tolerances is given. Finally, an antenna which is integrated into a QFN plastic package is characterized together with the chip-to-antenna interconnect.

Holographic mmW-Antennas With

This paper presents three different kinds of planar holographic antennas optimized for the usage in frequency-modulated-continuous-wave (FMCW)-radar systems. The antennas use different kinds of surface-wave modes (TE- and TM-modes), created by planar surface-wave launchers. Due to these feeds the antennas are very well suited for integration into millimeter-wave-systems. The radiation performance is calculated on the basis of holographic theory and the results are verified by full-wave simulations and measurements. Bidirectional radiation of the

{\rm TE}_0

{\bf{TE}}_0

and

-antennas is avoided by using artificial-magnetic-conductor (AMC) structures as antenna reflectors. This novel approach allows a holographic antenna with great integration qualifications and a highly directive and frequency-scanning main lobe and is compared with the also unidirectional

{\rm TM}_0

{\bf{TM}}_0

Surface Wave Launchers for Frequency-Scanning FMCW-Radars

-mode antenna.

Integration of a 140 GHz Packaged LTCC Grid Array Antenna With an InP Detector

Integration of a 140-GHz packaged low-temperature cofired ceramic (LTCC) antenna with a power detector is demonstrated under the concept of antenna-in-package. The detector is designed on an indium phosphide (InP) process. A grid array antenna in LTCC is designed to provide package for the detector. Coplanar ground-signal-ground (GSG) bond wires are used to connect the detector and the antenna. Parallel plate mode is observed in the InP substrate and absorbed by the LTCC substrate. The comparison between the measured responsivity of the power detector with and without the antenna indicates the acceptable insertion loss of the coplanar GSG bond wires transition. It shows a feasible solution for the D-band front-end integration and packaging.