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Helmut Keser

Brown, Boveri & Cie

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Archive | 1983

Method for directly joining metal pieces to oxide-ceramic substrates

Klaus Bunk; Arno Dipl Phys Dr Neidig; Georg Dipl Phys Dr Wahl; Helmut Keser

Archive | 1987

Method for the bubble-free joining of a large-area semiconductor component by means of soldering to a component part serving as substrate

Helmut Keser

Archive | 1986

Method for diffusing aluminum

Helmut Keser; Jan Voboril

Archive | 1983

Method for the direct bonding of copper articles to oxide-ceramic substrates

Klaus Bunk; Arno Dr. Dipl.-Phys. Neidig; Georg Dr. Dipl.-Phys. Wahl; Helmut Keser

Archive | 1982

VERFAHREN ZUM DIREKTEN VERBINDEN VON METALLSTUECKEN MIT OXIDKERAMIKSUBSTRATEN

Klaus Bunk; Arno Dipl Phys Dr Neidig; Georg Dipl Phys Dr Wahl; Helmut Keser

Archive | 1985

Process for the bubble-free bonding of a large-area semiconductor component to a substrate by soldering

Helmut Keser

Archive | 1985

Method of aluminium doping a semiconductor device

Helmut Keser; Jan Voboril

Archive | 1985

Procédé pour le dopage en aluminium d'un dispositif semi-conducteur

Helmut Keser; Jan Voboril

Archive | 1985

VERFAHREN ZUR ALUMINIUM-DOTIERUNG EINER HALBLEITERANORDNUNG.

Helmut Keser; Jan Voboril

Archive | 1985

A method of selectively diffusing aluminum into a silicon substrate

Helmut Keser; Jan Voboril

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