Heung Soap Choi

Recent Trends in Surface Treatment Technologies for Airframe Adhesive Bonding Processing: A Review (1995–2008)

Proper surface treatment technologies are prerequisite for achieving long-term service capability through the adhesive bonding process. However, the current surface treatment technologies used in the adhesive bonding process for aluminum alloys depend on materials that are undesirable from an environmental- or safety perspective. Suitable alternatives in the aerospace industry are the subject of much interest: non-chromate anodizing, silane, sol-gel, laser, plasma, and ion beam enhanced deposition of Al2O3 film. These approaches can eliminate, or greatly reduce, the undesirable hazardous materials and have been proven to deliver comparable bonding performance. In some cases these alternative processes may even outperform established processes, such as chromic and phosphoric acid anodizing.

Generalized Scaling of Urban Heat Island Effect and Its Applications for Energy Consumption and Renewable Energy

In previous work from this laboratory, it has been found that the urban heat island intensity (UHI) can be scaled with the urban length scale and the wind speed, through the time-dependent energy balance. The heating of the urban surfaces during the daytime sets the initial temperature, and this overheating is dissipated during the night-time through mean convection motion over the urban surface. This may appear to be in contrast to the classical work by Oke (1973). However, in this work, we show that if the population density is used in converting the population data into urbanized area, then a good agreement with the current theory is found. An additional parameter is the “urban flow parameter,” which depends on the urban building characteristics and affects the horizontal convection of heat due to wind. This scaling can be used to estimate the UHI intensity in any cities and therefore predict the required energy consumption during summer months. In addition, all urbanized surfaces are expected to exhibit this scaling, so that increase in the surface temperature in large energy-consumption or energy-producing facilities (e.g., solar electric or thermal power plants) can be estimated.

The effects of stacking sequence on the penetration-resistant behaviors of T800 carbon fiber composite plates under low-velocity impact loading

Impact damages induced by a low-velocity impact load on carbon fiber reinforced polymer (CFRP) composite plates fabricated with various stacking sequences were studied experimentally. The impact responses of the CFRP composite plates were significantly affected by the laminate stacking sequences. Three types of specimens, specifically quasi-isotropic, unidirectional, and cross-ply, were tested by a constant impact carrying the same impact energy level. An impact load of 3.44 kg, corresponding to 23.62 J, was applied to the center of each plate supported at the boundaries. The unidirectional composite plate showed the worst impact resistance and broke completely into two parts; this was followed by the quasi-isotropic lay-up plate that was perforated by the impact. The cross-ply composite plate exhibited the best resistance to the low-velocity impact load; in this case, the impactor bounced back. Impact parameters such as the peak impact force and absorbed energy were evaluated and compared for the impact resistant characterization of the composites made by different stacking sequences.

The effect of curing temperature on thermal, physical and mechanical characteristics of two types of adhesives for aerospace structures

Abstract The effects of cure temperatures on the thermal, physical and mechanical characteristics of two types of thermosetting structural epoxy film adhesives were determined in detail. The aim of this paper is to assess the effect of cure temperatures (82–121 °C) on the degree of cure of the two adhesives and the relevant void formations that need to be addressed in bonded part production and repair. Two thermal parameters were used to characterize the advancement of the reaction, such as degree of cure and glass transition temperature. The joint properties with respect to the cure temperatures were characterized by void content and bond-line thickness measurements and lap shear strength tests. Experimental results presented that all lap shear strengths were well within minimum shear strength (29 MPa) required by the specification of the film-type adhesive. However, the lap shear strength testing after aging at 82 °C and 95%R.H for 1000 h showed that the improved durability when the adhesive is cured at 121 °C did not occur for the 82 °C cure. Low curing conversion (75–77% degree of cure) combined with high voids (over 2 areal%) has a catastrophic effect on the bonding qualities at the metal-adhesive interface and due to lack of cohesion in the adhesive. The changes in the interface caused by the low temperature curing may contribute to an increased susceptibility of the bonded joint to moisture and consequent bond-line degradation.