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Hideaki Ishizawa

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Publication

Featured researches published by Hideaki Ishizawa.

Archive | 2008

Adhesive for electronic components

Hideaki Ishizawa; Akinobu Hayakawa; Kohei Takeda

Archive | 2009

Adhesive for electronic part

Akinobu Hayakawa; Hideaki Ishizawa; Ryohei Masui; Kohei Takeda; 良平 増井; 明伸 早川; 英亮 石澤; 幸平 竹田

Archive | 1998

Hardening type adhesive sheet

Hideaki Ishizawa; Makoto Miura; 誠 三浦; 英亮 石澤

Archive | 2008

ADHESIVE FOR JOINING ELECTRONIC PART

Akinobu Hayakawa; Hideaki Ishizawa; Kohei Takeda; 明伸 早川; 英亮 石澤; 幸平 竹田

Archive | 1998

Photopolymerizable composition, photocurable hardenable pressure sensitive adhesive sheet, and bonding of member

Hideaki Ishizawa; 英亮 石澤

Archive | 2009

Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device

Hideaki Ishizawa; Akinobu Hayakawa; Kohei Takeda

Archive | 1998

HARDENABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, HARDENABLE PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR BONDING ELECTRONIC MATERIAL COMPONENT

Hideaki Ishizawa; Makoto Miura; Kazuhiro Shimomura; 誠 三浦; 和弘 下村; 英亮 石澤

Archive | 2009

Bonding film, dicing-diebonding tape, and method of manufacturing semiconductor device

Akinobu Hayakawa; Hideaki Ishizawa; Atsushi Nakayama; 篤 中山; 明伸 早川; 英亮 石澤

Archive | 2008

Semiconductor chip laminate and manufacturing method thereof

Akinobu Hayakawa; Hideaki Ishizawa; Kohei Takeda; 明伸 早川; 英亮 石澤; 幸平 竹田

Archive | 2010

METHOD FO PRODUCING SEMICONDUCTOR CHIP STACK, AND SEMICONDUCTOR DEVICE

Akinobu Hayakawa; Hideaki Ishizawa; Kohei Takeda; Ryohei Masui

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Akinobu Hayakawa

Kyoto University

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