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Dive into the research topics where Hidemichi Fujiwara is active.

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Featured researches published by Hidemichi Fujiwara.


Journal of Physics: Conference Series | 2007

Formation of Rod Shape Secondary Aggregation of Copper Nanoparticles in Aqueous Solution of Sodium Borohydride with Stabilizing Polymer

Takuya Harada; Hidemichi Fujiwara

Morphological variations of copper nanoparticles synthesized by the reduction of copper acetate with sodium borohydride in the presence of poly(N-vinyl-2-pyrrolidone) (PVP) have been investigated. The results indicate that the specific rod shape secondary aggregation of copper nanoparticles are formed in the case that the oxygen is dissolved in the reacting solutions. Furthermore, it is also demonstrated that the copper nanorods with the aspect ratio of 2 - 20 and the average short axis length of 5 nm are synthesized in the weak oxidizing ambiance with a medium amount of PVP. The anomalous variations of copper nanoparticles are explained by the alignments of precursor copper ions and their reducing rates, which are modified by the density of resolved oxygen and the amount of PVP.


Archive | 2007

Method for producing fine particle dispersion and fine particle dispersion

Takuya Harada; Hidemichi Fujiwara; Kazuhiro Takashiba; N. Yamanaka; Yusuke Yamada; Hideo Nishikubo; Takashi Unno


Archive | 2007

Fine particle dispersion and method for producing fine particle dispersion

Takuya Harada; Hidemichi Fujiwara; Kazuhiro Takashiba; N. Yamanaka; Yusuke Yamada; Hideo Nishikubo; Takashi Unno


Archive | 2008

Heat transfer film, semiconductor device, and electronic apparatus

Masako Katayama; Hidemichi Fujiwara


Archive | 2012

Method for producing copper fine particle

Tomohiro Ishii; 智紘 石井; Toru Tateishi; 徹 立石; Hidemichi Fujiwara; 英道 藤原


Archive | 2011

Conductive connecting member and manufacturing method of same

Hideo Nishikubo; Shunji Masumori; Takuya Harada; Tomohiro Ishii; Hidemichi Fujiwara


Archive | 2011

Electrically conductive paste, and electrically conductive connection member produced using the paste

Shunji Masumori; Toshiaki Asada; Hidemichi Fujiwara


Archive | 2009

CONDUCTIVE MATERIAL FORMING METHOD, CONDUCTIVE MATERIAL FORMED USING THE SAME, AND DEVICE WITH CONDUCTIVE MATERIAL

Hidemichi Fujiwara; Takuya Harada; Shunji Masumori; Hideo Nishikubo; Norio Okubo; Yusuke Yamada; 琢也 原田; 俊二 増森; 典雄 大久保; 悠介 山田; 英道 藤原; 英郎 西久保


Archive | 2003

Power cable for mobile and terminal for the power cable

Hidemichi Fujiwara


Archive | 2011

Material for thermal bonding, coating material for thermal bonding, coating, and electronic component bonding method

Toshiaki Asada; Hidemichi Fujiwara

Collaboration


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Hideo Nishikubo

The Furukawa Electric Co.

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Shunji Masumori

The Furukawa Electric Co.

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Yusuke Yamada

The Furukawa Electric Co.

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Toshiaki Asada

The Furukawa Electric Co.

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Akihiko Kamio

Tokyo Institute of Technology

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N. Yamanaka

The Furukawa Electric Co.

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Takashi Unno

The Furukawa Electric Co.

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Tatsuo Sato

Tokyo Institute of Technology

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