Hideo Arima

THICK FILM TEMPERATURE COMPENSATING CIRCUIT FOR SEMICONDUCTOR STRAIN GAUGES

Thick film circuits were developed for temperature compensating of semiconductor strain gauges and for connecting the gauges to amplifiers in electronic pressure and differential pressure transmitters. In each circuit, ten Au pads for Al wire bonding and thirteen Ag/Pd pads for soldering must be fabricated on a small substrate. The results of the research are shown below.

Thick Film Capacitor Materials of thePowder–Glass Binary Systems and TheirDielectric Properties

Descriptions are given of the fundamental dielectric properties of the thick film binary system, composed of dielectric powder and glass, in relation to the effect of bulk properties of the constituent electrode composition in preventing a decrease in breakdown voltage with time and the effect of glass passivation on the reliability of thick film capacitors.