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Dive into the research topics where Hideo Nakanishi is active.

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Featured researches published by Hideo Nakanishi.


Applied Physics Letters | 2006

Suppression of crack generation in GaN epitaxy on Si using cubic SiC as intermediate layers

Jun Komiyama; Yoshihisa Abe; Shunichi Suzuki; Hideo Nakanishi

We demonstrate suppression of crack generation in GaN epitaxy on Si using cubic SiC as intermediate layers. Crack-free GaN with a thickness of 2μm was obtained. Epilayers of SiC (0–1μm), thin AlN (50nm), and GaN (1–3μm) were prepared on 3in. (111)Si substrates (GaN∕AlN∕SiC∕Si) by metalorganic vapor-phase epitaxy. Cracking of GaN is suppressed with thicker SiC (1μm), whereas cracks are generated in GaN without SiC and with thinner SiC (50nm). Transmission electron microscopy analysis revealed monocrystalline wurzite structure of GaN. Current-voltage measurements showed breakdown voltage exceeding 250V, indicating its potential for high voltage application.


Journal of Applied Physics | 2006

Stress reduction in epitaxial GaN films on Si using cubic SiC as intermediate layers

Jun Komiyama; Yoshihisa Abe; Shunichi Suzuki; Hideo Nakanishi

Stress in the epitaxial films of GaN on Si is reduced by using SiC as intermediate layers. The crystalline films of cubic SiC (0–1μm), thin AlN (50nm), and GaN (1–3μm) were prepared on 3in. (1 1 1) Si substrates—stacked in the order of GaN∕AlN∕SiC∕Si—by metalorganic vapor-phase epitaxy. It is revealed by Raman spectroscopy that the tensile stress in GaN is reduced to half (reduction of about 300MPa) for GaN on Si with SiC intermediate layers compared with GaN on Si without SiC intermediate layers. Because of stress reduction, crack-free GaN on Si with a thickness of 2μm was obtained by using SiC intermediate layers. Cracking was minimized even on thicker GaN on Si (3μm thick) with SiC intermediate layers. The SiC intermediate layers are promising for the realization of nitride based electronic devices on Si.


Journal of Applied Physics | 1991

Electrical conduction and electronic structures of novel tetrathionaphthalene derivatives

Y. Mori; Hideo Nakanishi; Bruno Hilti; Carl W. Mayer; Grety Rihs

The electrical conduction of pristine (undoped) and iodine doped vacuum deposited films of the novel donors, dibenzodithiotetra‐thionaphthalene and dibenzodithiotetraselenonaphthalene were measured. The electronic structures of these donor compounds were examined experimentally by ultraviolet photoelectron spectroscopy and theoretically by semiempirical MO calculations and compared with the corresponding data of tetrathiotetracene.


Archive | 1993

Vertical boat and a method for making the same

Takashi Tanaka; Jun Yoshikawa; Eiichi Toya; Atsuo Kitazawa; Kazunori Meguro; Tatsuo Nozawa; Yutaka Ishizuka; Yoshiyuki Watanabe; Masaru Seino; Hideo Nakanishi


Archive | 2007

Nitride semiconductor single crystal film

Jun Komiyama; Yoshihisa Abe; Shunichi Suzuki; Hideo Nakanishi


Journal of Crystal Growth | 2002

Dependence of Si melt flow in a crucible on surface tension variation in the Czochralski process

Hideo Nakanishi; Masayuki Watanabe; Kazutaka Terashima


Journal of Crystal Growth | 2007

Polarities of GaN films and 3C-SiC intermediate layers grown on (111) Si substrates by MOVPE

Jun Komiyama; Yoshihisa Abe; Shunichi Suzuki; Hideo Nakanishi


Archive | 2006

Substrate for compound semiconductor device and compound semiconductor device using the same

Jun Komiyama; Yoshihisa Abe; Shunichi Suzuki; Hideo Nakanishi


Journal of Crystal Growth | 2005

SiC epitaxial growth on Si(001) substrates using a BP buffer layer

Yoshihisa Abe; Jun Komiyama; Syunichi Suzuki; Hideo Nakanishi


Journal of Crystal Growth | 2005

Schottky diode characteristics of 3C-SiC grown on a Si substrate by vapor phase epitaxy

Jun Komiyama; Yoshihisa Abe; Shunichi Suzuki; Toru Kita; Hideo Nakanishi

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