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Hideo Senoo

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Publication

Featured researches published by Hideo Senoo.

Archive | 2001

Process for producing semiconductor device

Takashi Sugino; Hideo Senoo

Archive | 1996

Hardenable pressure-sensitive adhesive tape and method of using it

Masao Kogure; Hideo Senoo; Takashi Sugino

Archive | 1998

Hardenable pressure-sensitive adhesive composition and hardenable pressure-sensitive adhesive sheet

Yasukazu Nakada; Hideo Senoo; Takashi Sugino

Archive | 1996

Tacky adhesive tape and its application

Shunsaku Node; Hideo Senoo; Takashi Sugino

Archive | 1995

Sticking prevention method of adhesive agent to ring frame for dicing, adhesive sheet used in this method, and sheet for wafer working having this adhesive sheet

Hideo Senoo; Takashi Sugino

Archive | 1998

Adhesive sheet for wafer setting and process for producing electronic component

Hideo Senoo; Takashi Sugino; Shunsaku Node

Archive | 1995

Tacky adhesive tape and its method of use

Masao Kogure; Hideo Senoo; Takashi Sugino

Archive | 1997

Wafer pasting adhesive sheet and manufacturing method of electronic components

Shunsaku Node; Hideo Senoo; Takashi Sugino

Archive | 2001

Reinforcement material for silicon wafer and process for producing IC chip using said material

Yasukazu Nakata; Yuichi Iwakata; Takeshi Kondo; Hideo Senoo

Archive | 2001

HARDENABLE PRESSURE-SENSITIVE ADHESIVE TAPE

Hideo Senoo; Takashi Sugino; Takaji Sumi; Osamu Yamazaki

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Collaboration

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