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Archive | 2000

Resin-coated metal foil

Yasuo Imashiro; Takahiko Ito; Hideshi Tomita; Norimasa Nakamura

Archive | 1999

Adhesive film for semiconductor package

Yasuo Imashiro; Takahiko Ito; Hideshi Tomita; Norimasa Nakamura

Archive | 1996

Epoxy resin composition and epoxy resin-based adhesive

Satoshi Amano; Hideshi Tomita

Archive | 2006

Adhesive sheet with base for flexible printed wiring boards, production method therefor, multilayer flexible printed wiring board and flex-rigid printed wiring board

Katsuhiko Ito; Tatsuo Yonemoto; Tomoaki Sawada; Ikuo Takahashi; Hideshi Tomita

Archive | 2002

Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board

Yasuo Imashiro; Takahiko Ito; Hideshi Tomita; Norimasa Nakamura

Archive | 1999

Resin composition for use in sealant and liquid sealant using the resin composition

Satoshi Amano; Hideshi Tomita

Archive | 1995

Process for production of polycarbodiimide resin powder

Satoshi Amano; Tomoki Nakamura; Takahiko Ito; Hideshi Tomita; Norimasa Nakamura

Archive | 1993

Method of adhering adherends

Yasuo Imashiro; Kazuo Saito; Satoshi Amano; Takahiko Itoh; Hideshi Tomita; Ikuo Takahashi

Archive | 2001

Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition

Yasuo Imashiro; Takahiko Ito; Hideshi Tomita; Norimasa Nakamura

Archive | 2000

LCP bonding method

Yasuo Imashiro; Hideshi Tomita; Takahiko Itoh; Norimasa Nakamura

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