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Publication


Featured researches published by Hidetsugu Motobe.


Archive | 2004

Epoxy Resin Composition for Prepreg, Prepreg and Multilayered Printed Wiring Board

Hidetsugu Motobe; Yoshihiko Nakamura; Takeshi Koizumi; Ryuji Matsushita Electric Works Ltd. Takahashi


Archive | 2004

Resin composition for printed wiring board, prepreg laminate, and printed wiring board made with the same

Hidetsugu Motobe; Akinori Hibino; Katsuhiko Ito


Archive | 2003

Resin composition for printed wiring board, prepreg, and laminate obtained with the same

Hidetsugu Motobe; Akinori Hibino; Katsuhiko Ito


Archive | 2003

Resin composition for printed wiring board, prepreg, laminate and printed wiring board using the same

Hidetsugu Motobe; Akinori Hibino; Katsuhiko Ito


Archive | 2001

Process for making epoxy resin prepregs and laminates

Yoshihiko Nakamura; Masahiro Matsumura; Narimasa Iwamoto; Hidetsugu Motobe; Yukio Hatta


Archive | 1999

Prepreg of epoxy resin, hardener, and organodialkyurea promotor

Yoshihiko Nakamura; Masahiro Matsumura; Narimasa Iwamoto; Hidetsugu Motobe; Yukio Hatta


Archive | 2006

Prepreg for printed wiring board and copper-clad laminated board

Katsuhiko Itou; Akinori Hibino; Hidetsugu Motobe


Archive | 2016

RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD

Toshiyuki Higashida; Hidetsugu Motobe; Daisuke Nii


Archive | 2004

印刷配線板用樹脂組成物、プリプレグ、積層板、及びこれを用いたプリント配線板

Hidetsugu Motobe; Akinori Hibino; Katsuhiko Ito


Archive | 2004

Composition de resine pour cartes imprimees, preimpregne, lamine, et carte imprimee obtenue

Hidetsugu Motobe; Akinori Hibino; Katsuhiko Ito

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