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Hin Hwa Goh

STATS ChipPAC Ltd

Publication

Featured researches published by Hin Hwa Goh.

Archive | 2009

Semiconductor Device and Method of Forming an Interconnect Structure with TSV Using Encapsulant for Structural Support

Nathapong Suthiwongsunthorn; Pandi C. Marimuthu; Jae Hun Ku; Glenn Omandam; Hin Hwa Goh; Kock Liang Heng; Jose Alvin Caparas

Archive | 2005

Semiconductor package flip chip interconnect having spacer

Jae Soo Lee; Geun Sik Kim; Sheila Marie L. Alvarez; Robinson Quiazon; Hin Hwa Goh; Frederick Rodriguez Dahilig

Archive | 2007

Etched leadframe flipchip package system

Il Kwon Shim; Sheila Marie L. Alvarez; Hin Hwa Goh; Robinson Quiazon

Archive | 2011

Semiconductor device and method of forming FO-WLCSP with multiple encapsulants

Yaojian Lin; Jose Alvin Caparas; Kang Chen; Hin Hwa Goh

Archive | 2008

Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution

Byung Tai Do; Stephen A. Murphy; Yaojian Lin; Heap Hoe Kuan; Pandi C. Marimuthu; Hin Hwa Goh

Archive | 2014

Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief

Yaojian Lin; Pandi C. Marimuthu; Kang Chen; Hin Hwa Goh; Yu Gu; Il Kwon Shim; Rui Huang; Seng Guan Chow; Jianmin Fang; Xia Feng

Archive | 2008

Semiconductor device and method of placing semiconductor die on a temporary carrier using fiducial patterns

Yaojian Lin; Rui Huang; Hin Hwa Goh

Archive | 2011

Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support

Nathapong Suthiwongsunthorn; Pandi C. Marimuthu; Jae Hun Ku; Glenn Omandam; Hin Hwa Goh; Kock Liang Heng; Jose Alvin Caparas

Archive | 2010

Integrated circuit packaging system with warpage control and method of manufacture thereof

Yung Kuan Hsiao; XuSheng Bao; Kang Chen; Hin Hwa Goh; Rui Huang

Archive | 2010

Semiconductor Device and Method of Laser-Marking Laminate Layer Formed Over EWLB With Tape Applied to Opposite Surface

Glenn Omandam; Yaojian Lin; Hin Hwa Goh

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