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Hirayama Takamasa

Nitto Denko

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Publication

Featured researches published by Hirayama Takamasa.

Archive | 2013

Heat-releasable adhesive sheet for cutting electrical component and electrical component cutting method

Hirayama Takamasa; Shimokawa Daisuke; Kiuchi Kazuyuki

Archive | 2012

HEAT-RESISTANT ADHESIVE TAPE FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP USING THE SAME

Shimokawa Daisuke; Shimazaki Yuta; Imoto Eiichi; Hirayama Takamasa; Soejima Kazuki

Archive | 2015

Heat-peelable adhesive tape and cutting method of electronic components

Soejima Kazuki; Shimokawa Daisuke; Hirayama Takamasa; Kitayama Kazuhiro

Archive | 2016

Thermal peeling adhesive sheet

Soejima Kazuki; Fukuhara Junji; Hirayama Takamasa; Arimitsu Yukio

Archive | 2016

Thermal release adhesive tape

Soejima Kazuki; Fukuhara Junji; Hirayama Takamasa; Arimitsu Yukio

Archive | 2015

HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE TAPE AND CUTTING METHOD OF ELECTRONIC COMPONENTS

Kitayama Kazuhiro; Shimokawa Daisuke; Hirayama Takamasa; Soejima Kazuki

Archive | 2015

THERMAL PEELING TYPE ADHESIVE TAPE FOR CUTTING-OFF ELECTRONIC COMPONENT AND CUTTING-OFF METHOD OF ELECTRONIC COMPONENT

Soejima Kazuki; Shimokawa Daisuke; Hirayama Takamasa; Kitayama Kazuhiro

Archive | 2015

THERMAL PEELING TYPE ADHESIVE TAPE AND CUTTING-OFF METHOD OF ELECTRONIC COMPONENT

Kitayama Kazuhiro; Shimokawa Daisuke; Hirayama Takamasa; Soejima Kazuki

Archive | 2014

Thermal-release adhesive tape and cutting method of electronic component

Kitayama Kazuhiro; Shimokawa Daisuke; Hirayama Takamasa; Soejima Kazuki

Archive | 2014

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND ADHESIVE SHEET USED IN METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Hirayama Takamasa; Shimokawa Daisuke

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Shimokawa Daisuke

Nitto Denko

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Kiuchi Kazuyuki

Nitto Denko

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