Hiroaki Kurihara

Method for controlling whisker in tinning

Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape

Printed Wiring Board, Process For Producing the Same and Semiconductor Device

Wiring board and semiconductor device excellent in folding endurance

Printed wiring board, method of manufacturing the same, and electrolytic copper foil for copper clad laminate used for manufacturing printed wiring board

Film Carrier Tape for Mounting Electronic Components and Method of Manufacturing the Film Carrier Tape

Two-layer flexible printed wiring board and method for manufacturing the two-layer flexible printed wiring board

Semiconductor device, manufacture thereof, card-like semiconductor device and manufacture thereof

OS0520 Ratchet Deformation and Creep Constitutive Model of Electroplating Copper Foil

フレキシブル銅張積層板、そのフレキシブル銅張積層板を用いて得られるフレキシブルプリント配線板、そのフレキシブル銅張積層板を用いて得られるフィルムキャリアテープ、そのフレキシブル銅張積層板を用いて得られる半導体装置、フレキシブル銅張積層板の製造方法及びフィルムキャリアテープの製造方法