Hotspot


Archive | 1997

Cerium oxide abrasive and method of polishing substrates

Masato Yoshida; Toranosuke Ashizawa; Hiroki Terazaki; Yasushi Kurata; Jun Matsuzawa; Kiyohito Tanno; Yuuto Ootuki


Archive | 1998

Abrasive, method of polishing wafer, and method of producing semiconductor device

Masato Yoshida; Toranosuke Ashizawa; Hiroki Terazaki; Yuuto Ootuki; Yasushi Kurata; Jun Matsuzawa; Kiyohito Tanno


Archive | 2006

Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same

Takeshi Uchida; Tetsuya Hoshino; Hiroki Terazaki; Yasuo Kamigata; Naoyuki Koyama; Yoshio Honma; Seiichi Kondoh


Archive | 1999

Abrasive liquid for metal and method for polishing

Takeshi Uchida; Jun Matsuzawa; Tetsuya Hoshino; Yasuo Kamigata; Hiroki Terazaki; Yoshio Honma; Seiichi Kondoh


Archive | 2003

Polishing fluid and method of polishing

Yasushi Kurata; Yasuo Kamigata; Sou Anzai; Hiroki Terazaki


Archive | 2002

CMP (chemical mechanical polishing) polishing liquid for metal and polishing method

Yasushi Kurata; Yasuo Kamigata; Takeshi Uchida; Hiroki Terazaki; Akiko Igarashi


Archive | 2005

Metal polishing liquid and polishing method using it

Yutaka Nomura; Hiroki Terazaki; Hiroshi Ono; Yasuo Kamigata


Archive | 2007

Abrasive, method of polishing target member and process for producing semiconductor device

Masato Yoshida; Toranosuke Ashizawa; Hiroki Terazaki; Yuuto Ootuki; Yasushi Kurata; Jun Matsuzawa; Kiyohito Tanno


Archive | 2005

Metal-Polishing Liquid And Polishing Method Using The Same

Yutaka Nomura; Hiroki Terazaki; Hiroshi Ono; Yasuo Kamigata


Archive | 2009

Abrasive, method of polishing substrate and process for producing semiconductor device

Masato Yoshida; Toranosuke Ashizawa; Hiroki Terazaki; Yuuto Ootuki; Yasushi Kurata; Matsuzawa Jun; Kiyohito Tanno

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