Hiroshi Honmou

A surface mount type single-mode laser module using passive alignment

A novel single-mode laser module has been developed using a surface mounting technique. A simple receptacle structure for the module output port is also designed. This module offers high coupling efficiency and optical coupling using the passive alignment technique. A module size of 7.6 mm/spl times/12 mm/spl times/3 mm is achieved, which is very friendly for the automatic assembly line as well as the module mounting process on circuit boards. A laser diode (LD) is passively positioned by utilizing a pair of alignment marks, each of which located on the LD and Si substrate, a single-mode fiber with a microhemispherical lens on the fiber facet is self-aligned on a Si-V groove. The LD to single-mode fiber coupling loss and standard deviation are found to be 5 dB and 1.5 db, respectively. The simple receptacle structure enables one to use this module in the same way as conventional surface mount electrical components. The module assembly process is simplified by successively mounting subassembly parts.

128 line photonic switching system using LiNbO/sub 3/ switch matrices and semiconductor traveling wave amplifiers

The possibility of a 128-line photonic space division switching system incorporating LiNbO/sub 3/ switch matrices and semiconductor traveling wave amplifiers (TWAs) is discussed. System design is considered in terms of the most suitable location for the TWA devices that gives the most practical power margin. Design requirements for a 128-line photonic switching system suitable for a small-sized private branch exchange requirement are presented along with experimental results. It has been shown that a five-stage switch cascade, suitable for such a high-capacity switching system with a power margin of greater than 5 dB in the highest switch loss situation is possible, using low-facet-reflection TWAs. Such TWA devices have been developed in the 1.3- mu m wavelength region with maximum fiber-to-fiber gain values of 15 dB. With maximum gain-polarization dependencies of 3 dB, switch losses can be compensated even under TM mode operation. >

12-channel parallel optical-fiber transmission using a low-drive current 1.3- mu m LED array and a p-i-n PD array

Twelve-channel 14-Mb/s/channel 1-km parallel optical-fiber transmission using a 1*12 low-drive-current 1.3- mu m light-emitting diode (LED) linear array and an InGaAs p-i-n photodiode linear array, with the LED drive current as low as 12 mAp-p/channel, is discussed. No receiver sensitivity degradation has been observed under simultaneous 12-channel operation. The skew was less than 6 ns after transmission through a 1-km-long 12-channel optical-fiber cable, which was sufficiently small for 14-Mb/s parallel transmission. >

Use of AuSn solder bumps in three-dimensional passive aligned packaging of LD/PD arrays on Si optical benches

Precise three-dimensional passive alignment of LD/PD arrays on Si optical benches has been achieved by means of AuSn solder bumps. A punch-and-die technique is used to fabricate the AuSn solder bumps to an extremely high accuracy (/spl plusmn/2 /spl mu/m) in bump height. A stripe-type bump bonding technique is employed to attain precise vertical alignment (/spl plusmn/1 /spl mu/m) of an LD array chip. Average LD-single-mode fiber array coupling loss was as low as -9.5/spl plusmn/0.5 dB, and while that of a PD-multimode fiber array was -0.4/spl plusmn/0.3 dB, almost as good as that with active alignment.

Self-aligned Assembly Technology For Optical Devices Using AuSn Solder Bumps Flip-chip Bonding

A flip-chip bonding technique using AuSn solder bumps, which are mechanically formed an the substrate, has been developed. Self-aligned assembly used in laser diode chip was realized with /spl plusmn/1/spl mu/m bonding Positioning precision.

Self-aligned assembly technology for laser diode modules using stripe-type AuSn solder bump flip-chip bonding

Alignment-free laser diode module assembly technology has been developed. The laser diode is self-aligned to a single-mode optical fiber (SMF) by using stripe-type AuSn solder bumps. Alignment error of /spl plusmn/1 /spl mu/m has been achieved.

150 Mbits−1 ch−1 12-channel optical parallel interface using an LED and a PD array

An optical fibre parallel interface has been developed for card-cage to card-cage and board-to-board interconnections, representing a practical and promising optical interconnection. For a system design of a 12 channel, 150 Mbits−1 ch−1 optical parallel interface over a distance of 100 m, it is shown that the choice of a long wavelength LED/PD array with graded index optical fibre array meets the requirements for both power budget and skew limitation over this transmission distance. A 7 mm thick compact package transmitter and receiver module was developed, employing a Zn-doped, mesa structure, 1.3μm LED array and an isolated InGaAs PD array. An optical parallel transmission experiment over 100 m was successfully demonstrated using these modules.

Compact multi-channel LED/PD array modules using new assembly techniques for hundred Mb/s/ch parallel optical transmission

Compact 12-channel LED/PD (light emitting diode/photodiode) array modules using novel assembly techniques have been developed for high-speed parallel optical transmission. Optical and electronic devices were mounted on a lateral point and the common submount surfaces, respectively, for high-speed operation and module package miniaturizing. The flip-chip technique by solder bumps was employed for optical array chip bonding, in order to simplify the chip mounting., A 12-channel 150- Mbit/s/ch 100-m parallel optical transmission with small electronic crosstalk has been demonstrated.<<ETX>>