Hiroshi Horikoshi
Sony Broadcast & Professional Research Laboratories
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Publication
Featured researches published by Hiroshi Horikoshi.
symposium on vlsi technology | 2002
Shingo Takahashi; Kaori Tai; Hiizu Ohtorii; Naoki Komai; Yuji Segawa; Hiroshi Horikoshi; Z. Yasuda; H. Yamada; M. Ishihara; Takeshi Nogami
A fragile porous ultra-low-k (k=2.2) silica was successfully integrated at trench level in damascene copper by applying our previously reported [1] electro chemical polishing (ECP) technique for Cu. After removing Cu by ECP, the barrier (WN) was removed by low pressure (LP) CMP (<1 psi). Practical polishing rates were obtained for WN in LP-CMP, because of higher chemical sensitivity of WN compared to Ta(N). Compatibility of CVD barrier to porous low-k, excellent barrier performance in aggressive features and lower via resistance were achieved by a newly developed CVD/PVD stacked WN barrier.
Archive | 2010
Hiroshi Horikoshi; Koji Kikuchi; Tomohiro Yamazaki
Archive | 2005
Hiroshi Horikoshi
Archive | 2006
Hiroshi Horikoshi
Archive | 2002
Hiroshi Horikoshi; Hisanori Komai; Takeshi Nogami; Suguru Otorii; Shuzo Sato; Kaori Tai; Shingo Takahashi; 佐藤 修三; 堀越 浩; 大鳥居 英; 田井 香織; 野上 毅; 駒井 尚紀; 高橋 新吾
Archive | 2004
Hiroshi Horikoshi; Shigeo Ishihara; Hisanori Komai; Takeshi Nogami; Shuzo Sato; Yuji Segawa; Yoshiya Yasuda; 修三 佐藤; 浩 堀越; 善哉 安田; 雄司 瀬川; 成郎 石原; 毅 野上; 尚紀 駒井
Archive | 2003
Shuzo Sato; Takeshi Nogami; Shingo Takahashi; Naoki Komai; Kaori Tai; Hiroshi Horikoshi; Hiizu Ohtorii
Archive | 2003
Hiroshi Horikoshi; Takeshi Nogami; Shuzo Sato; Shingo Takahashi; Naoki Komai; Kaori Tai; Hiizu Ohtorii
Archive | 2007
Hiroshi Horikoshi
Archive | 2014
Kazuto Watanabe; Atsushi Matsushita; Hiroshi Horikoshi; Iwao Sugiura; Yuuji Nishimura; Syota Yamabata
