Hiroshi Matsutani

Development of low temperature curable positive tone photosensitive dielectric material

Recently, low temperature curable photosensitive dielectric materials are attracting much attention in semiconductor package application to avoid thermal damages of the semiconductor devices. AH-1000 is a low temperature curable positive tone photo- definable material. In this paper, we report the mechanical, thermal, and adhesion property of AH-1000 together with its chemical resistance. A wafer level package (WLP) using AH-1000 as redistribution layers indicates that AH-1000 has enough mechanical toughness. It also suggests that higher elongation and lower Youngs modulus are effective to eliminate mechanical stress to solder balls for dielectrics.

Photosensitive insulation coating for a copper redistribution layer process

Redistribution on a through-silicon via (TSV) with a copper interconnection and dielectric layer is one of the key components for a silicon-based interposer. In this paper, we report lithographic and mechanical performance for a positive-tone photosensitive insulation coating, CA6001B. Minimum resolution for CA6001B is 3 μm determined by electrical measurement with a test wafer having a copper redistribution and the patterned insulation layers. The CA6001B is one of the promising dielectric coatings for interposers possessing TSV and redistribution layer (RDL) structures.