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2010 14th International Heat Transfer Conference, Volume 1 | 2010

Wall Thermal Conductivity Effects on Nucleation Site Interaction During Boiling: An Experimental Study

Yuyan Jiang; Hiroshi Osada; Masahide Inagaki; Nariaki Horinouchi

The past decades have witnessed the diverse applications of boiling heat transfer enhancement in the removal of high density heat flux released by electronic components or power devices. People have developed many enhanced surfaces to obtain the highest heat transfer coefficient in nucleate boiling or to raise the CHF. In the boiling arena bubbling and nucleation site density play core parts, and hence it is crucial to correlate them quantitatively with surface structure and heat transfer conditions. For example one can determine by that correlation the best arrangement of boiling cavities for a given heat flux. However, the bubbling is highly influenced by inter-bubble actions. It has been found that the interactions can considerably change the bubble’s size, frequency and spatial distribution. The interactions are needed to be taken accounts of for a good correlation. Researchers tried to formulate the interactions as a single function of the inter-site spacing but have obtained contradictory conclusions, as suggests that they depend also on other parameters. In the present study we conducted a saturated boiling heat transfer experiment to investigate the interactions with respects to both the inter-site spacing and the wall thermal conductivity. The test section was fabricated by both copper and stainless steel, whose surface has two cylindrical artificial cavities of 50μm in diameter. It was heated with a uniform heat flux. The results show that both the bubble diameter Db and frequency f are functions of the inter-cavity distance s, but they vary in different manners in the copper and the stainless steel surfaces. In the copper surface, we observed evident enhancement of the boiling heat transfer at 1> S >0.4 and a slight inhibitive effect at 1.6> S >1, where S = s/Db . On the contrary the two nucleate sites in the stainless steel surface interfere with each other giving rise to evident suppression of boiling heat transfer at 1.6> S >0.65 and only slight enhancement at 0.65> S >0.3. Note that the copper’s thermal conductivity is 22 times larger than the stainless steel. Numerical simulation has revealed that the temperature variation beneath the copper cavities is much less than the stainless steel, which partly explains the differences in our experimental results. It is suggested that modeling the bubble interactions should take accounts of not only the distance-to-diameter ratio but also the fluid and wall properties.Copyright


Archive | 2008

Semiconductor element cooling structure

Tadafumi Yoshida; Hiroshi Osada; Yutaka Yokoi


Archive | 2007

HEAT SINK AND COOLER

Tadafumi Yoshida; Hiroshi Osada; Yutaka Yokoi


International Journal of Heat and Mass Transfer | 2013

Dynamic modeling on bubble growth, detachment and heat transfer for hybrid-scheme computations of nucleate boiling

Yuyan Jiang; Hiroshi Osada; Masahide Inagaki; Nariaki Horinouchi


Archive | 2008

Cooling structure for semiconductor device

Tadafumi Yoshida; Hiroshi Osada; Yutaka Yokoi


Archive | 2010

Junction body, semiconductor module, and manufacturing method for junction body

Yasushi Yamada; Hiroshi Osada; Yuji Yagi; Tadafumi Yoshida


Archive | 2007

COOLING DEVICE AND VEHICLE PROVIDED WITH THE SAME

Tadafumi Yoshida; Yutaka Yokoi; Hiroshi Osada


Heat Transfer Research | 2001

Research on corrugated multi-louvered fins under dehumidification

Hiroshi Osada; Hiroshi Aoki; Toshio Ohara; Isao Kuroyanagi


Archive | 2007

Cooling device and vehicle with the same

Tadafumi Yoshida; Yutaka Yokoi; Hiroshi Osada


Japanese Journal of Applied Physics | 1993

Ultrafine-Particle Beam Deposition III: Applications to Thermoelectric Materials

Yoshimi Kizaki; Hiroshi Osada; Hiroshi Aoki

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