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Dive into the research topics where Hiroyoshi Kawasaki is active.

Publication


Featured researches published by Hiroyoshi Kawasaki.


Synthetic Communications | 2015

Synthesis of Novel Spiro[indol-2,2′-pyrroles] Using Isocyanide-Based Multicomponent Reaction

Venkataprasad Jalli; Suvratha Krishnamurthy; Hiroyoshi Kawasaki; Tetsuji Moriguchi; Akihiko Tsuge

Abstract An efficient and facile method for the synthesis of novel spiro[indole-2,2′-pyrroles] from N-methyl-3-isatin imines, t-butyl isocyanide, and dialkyl acetylenedicarboxylate has been achieved by [3 + 2] cyclo addition reaction. All the products were purified by column chromatography as yellow solids and confirmed with 1H NMR, 13C NMR, fast atom bombardment, mass, and infrared. Compound 11 was further confirmed with x-ray analysis. GRAPHICAL ABSTRACT


IEEE Transactions on Nuclear Science | 2015

Energy Dependent Efficiency in Low Background Alpha Measurements and Impacts on Accurate Alpha Characterization

Hiroyoshi Kawasaki; Brett M. Clark; Tomoaki Nishino; Michael S. Gordon

A difference in low emissivity alpha particle measurements for the same samples was observed between an Alpha Sciences model 1950 gas proportional counter and the XIA UltraLo-1800 ionization chamber. The energy dependent efficiency was evaluated for each instrument to reconcile the difference, and the implication of instrument design bias on measurement results is presented.


cpmt symposium japan | 2015

Improving self-alignment effect of Cu balls by organic and inorganic surface coating

Hiroyoshi Kawasaki; Tomoaki Nishino; Takahiro Roppongi; Daisuke Soma; Isamu Sato; Yuji Kawamata; Hirohiko Hirao; Jun Tasaka

A good correlation between the thickness of oxidation layer of Cu balls and their movement on the solder bumps has been found out, suggesting that non-oxidized Cu balls without no oxygen atmosphere could be a good condition in terms of self-alignment in packaging. We have succeeded in developing novel coated Cu balls that can be stored under mild conditions.


cpmt symposium japan | 2013

Cu balls and Cu-core balls for 3D packaging

Hiroyoshi Kawasaki; Takahiro Hattori; Takahiro Roppongi; Daisuke Soma; Yuji Kawamata

The use of Cu balls and Cu-core balls is focused on 3D packaging technology to maintain a stable standoff height. However, these materials show unique soldering behaviors that are different from solder balls. In this paper, we examine how to utilize them.


Archive | 2016

Cu Core Ball

Hiroyoshi Kawasaki; Tomohiko Hashimoto; Atsushi Ikeda; Takahiro Roppongi; Daisuke Soma; Isamu Sato; Yuji Kawamata


Archive | 2016

Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, and Solder Foam

Hiroyoshi Kawasaki; Takahiro Roppongi; Daisuke Soma; Isamu Sato


Archive | 2015

CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND SOLDER JOINT

Hiroyoshi Kawasaki; Shigeki Kondo; Atsushi Ikeda; Takahiro Roppongi; Daisuke Soma; Isamu Sato


Archive | 2017

Ni Ball, Ni Core Ball, Solder Joint, Solder Paste, and Solder Foam

Hiroyoshi Kawasaki; Takashi Akagawa; Yuichi Koikeda; Atsushi Ikeda; Masaru Sasaki; Takahiro Roppongi; Daisuke Soma; Isamu Sato


Archive | 2015

Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste

Takashi Akagawa; Hiroyoshi Kawasaki; Kazuhiko Matsui; Daisuke Soma; Masaru Sasaki; Takahiro Roppongi; Hiroyuki Yamasaki; Yuichi Koikeda; Isamu Sato


Archive | 2015

Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT

Hiroyoshi Kawasaki; Takahiro Roppongi; Daisuke Soma; Isamu Sato

Collaboration


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Akihiko Tsuge

Kyushu Institute of Technology

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Koji Araki

Kyushu Institute of Technology

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Tetsuji Moriguchi

Kyushu Institute of Technology

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Daisaku Kaneko

Japan Advanced Institute of Science and Technology

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Daisuke Yakeya

Kyushu Institute of Technology

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Masahiro Yokoo

Kyushu Institute of Technology

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Suvratha Krishnamurthy

Kyushu Institute of Technology

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Tsugumichi Fujiwara

Kyushu Institute of Technology

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