Hiroyuki Minami

A super low noise V-band AlInAs/InGaAs HEMT processed by selective wet gate recess etching

A 0.15 /spl mu/m T-shaped gate AlInAs/InGaAs high electron mobility transistor (HEMT) with excellent RF performances has been developed using a selective wet gate recess etching. An extremely low minimum noise figure (Fmin) of 0.9 dB with an associated gain (Ga) of 7.0 dB has been achieved at 60 GHz for a SiON-passivated device. This is the lowest value of Fmin ever reported for AlInAs/InGaAs HEMT with a passivation film.<<ETX>>

A high reliability GaN HEMT with SiN passivation by Cat-CVD

This is the first report of catalytic vapor deposition (Cat-CVD) passivated AlGaN/GaN HEMT. We have found out that the Cat-CVD passivation film with NH3 treatment greatly enhances the reliability of the AlGaN/GaN HEMT. It is rationalized, through the low frequency capacitance-voltage measurement, that the NH3 treatment in the Cat-CVD reactor before the SiN film deposition minimizes the damage at the SiN/AlGaN interface, leading to reducing the surface trap density. The AlGaN/GaN HEMT passivated by the Cat-CVD SiN film suppresses the degradation of an output power to less than 0.4 dB under the RF operation of Vd = 30 V, f = 5 GHz after 200 h.

Design of W-band monolithic low noise amplifiers using accurate HEMT modeling

A W-band monolithic two-stage low noise amplifiers have been developed using new accurate HEMT modeling. The modeling includes intrinsic FET noise parameters that are independent of frequency. A noise figure of 5.5 dB with an associated gain of 8.7 dB is achieved at 91 GHz when biased for low noise figure, and a small signal gain of 10.4 dB with noise figure of 5.9 dB is obtained when biased for high gain. Good agreement between measured and simulated data of the low noise amplifier verifies the HEMT modeling.<<ETX>>

A super low noise AlInAs/InGaAs HEMT processed by selective wet gate recess etching

A 0.15 /spl mu/m T-shaped gate AlInAs/InGaAs high electron mobility transistor (HEMT) with excellent RF performance has been developed using a selective wet gate recess etching. The etching condition for recess formation is optimized and an extremely low minimum noise figure (F/sub min/) of 0.9 dB with an associated gain (G/sub a/) of 7.0 dB has been achieved at 60 GHz for a SiON-passivated device.