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Hisashi Okuchi

Toshiba

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Archive | 2008

Method of treating surface of semiconductor substrate

Hiroshi Tomita; Hiroyasu Iimori; Hisashi Okuchi; Tatsuhiko Koide; Linan Ji

Archive | 2010

Method of treating a semiconductor substrate

Hiroshi Tomita; Tatsuhiko Koide; Hisashi Okuchi; Kentaro Shimayama; Hiroyasu Iimori; Linan Ji

Archive | 1999

Wafer drying apparatus and method with residual particle removability enhancement

Hisashi Okuchi; Hiroshi Tomita; Soichi Nadahara; Katsuya Okumura

Archive | 2007

Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor device

Hisashi Okuchi; Hiroyasu Iimori; Mami Saito; Yoshihiro Ogawa; Hiroshi Tomita; Soichi Nadahara

Archive | 2010

APPARATUS AND METHOD OF TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE

Yoshihiro Ogawa; Tatsuhiko Koide; Shinsuke Kimura; Hisashi Okuchi; Hiroshi Tomita

Archive | 2012

SUPERCRITICAL DRYING METHOD AND SUPERCRITICAL DRYING SYSTEM

Yukiko Kitajima; Hiroshi Tomita; Hidekazu Hayashi; Hisashi Okuchi; Yohei Sato

Archive | 2006

Etching method and apparatus for semiconductor wafers

Yoshihiro Ogawa; Hisashi Okuchi; Hiroshi Tomita; Hiroyasu Iimori

Archive | 2011

Supercritical drying method for semiconductor substrate

Hidekazu Hayashi; Hiroshi Tomita; Yukiko Kitajima; Hisashi Okuchi; Yohei Sato

Archive | 2010

SUPERCRITICAL DRYING METHOD AND SUPERCRITICAL DRYING APPARATUS

Yukiko Kitajima; Hisashi Okuchi; Hiroshi Tomita; Hidekazu Hayashi; Tatsuhiko Koide

Archive | 2009

MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

Hisashi Okuchi

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