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Dive into the research topics where Hisashi Suda is active.

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Featured researches published by Hisashi Suda.


Materials Science Forum | 2010

Effect of Prior Cold-Working on Strength and Electrical Conductivity of Cu-Ti Dilute Alloy Aged in a Hydrogen Atmosphere

Satoshi Semboshi; Hiroshi Numakura; Wei Lin Gao; Hisashi Suda; Akira Sugawara

Aging solution-treated Cu-Ti alloys in a hydrogen atmosphere significantly improved their electrical conductivity without degradation of the mechanical strength, compared to conventionally aged alloys. In this study, the influence of prior deformation on the mechanical and electrical properties of Cu-4.2 at.% Ti alloys aged in a hydrogen atmosphere was examined. The Vickers hardness of the solution-treated specimen increased from 127 kgf/mm2 to 265 kgf/mm2 by aging at 673 K for 180 h in a hydrogen atmosphere of 0.8 MPa, while that of the deformed specimen achieved a maximum of approximately 280 kgf/mm2 by aging for 100 h in the same atmosphere. Prior deformation resulted in a more rapid increase in conductivity during aging than that without deformation. The conductivity at the peak-hardness of the deformed specimen was 22% IACS (International Annealed Copper Standard), which exceeded that for the solution-treated specimen. Thus, prior deformation assisted in a significant improvement of the mechanical and electrical properties during aging in a hydrogen atmosphere.


Archive | 2006

High-strength copper alloy sheet showing little anisotropy, and manufacturing method therefor

Hisatoshi Araki; Irin Ko; Hisashi Suda; Akira Sugawara; Yoshimune Yamagishi; 義統 山岸; 久寿 荒木; 章 菅原; 久 須田; 維林 高


Archive | 2008

Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same

Weilin Gao; Hisashi Suda; Hiroto Narieda; Akira Sugawara


Archive | 2009

HIGH STRENGTH COPPER ALLOY PLATE MATERIAL AND METHOD FOR PRODUCING THE SAME

Weilin Gao; Hisashi Suda; Akira Sugawara; 章 菅原; 久 須田; 維林 高


Archive | 2007

SHEET MATERIAL OF Cu-Ni-Si-BASED COPPER ALLOY AND MANUFACTURING METHOD THEREFOR

Irin Ko; Hiroto Narueda; Hisashi Suda; Akira Sugawara; 宏人 成枝; 章 菅原; 久 須田; 維林 高


Archive | 2007

Cu-Zn-Sn BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING THE SAME, AND CONNECTOR

Irin Ko; Hiroto Narueda; Hisashi Suda; Akira Sugawara; 宏人 成枝; 章 菅原; 久 須田; 維林 高


Archive | 2006

Cu-Ni-Si TYPE COPPER ALLOY SHEET WITH EXCELLENT PROOF STRESS AND BENDABILITY

Hisatoshi Araki; Irin Ko; Hisashi Suda; Akira Sugawara; Yoshimune Yamagishi; 義統 山岸; 久寿 荒木; 章 菅原; 久 須田; 維林 高


Archive | 2007

Copper alloy sheet and its manufacturing method

Irin Ko; Hiroto Narueda; Hisashi Suda; Akira Sugawara; 宏人 成枝; 章 菅原; 久 須田; 維林 高


Archive | 2008

Copper alloy sheet, and method for producing the same

Irin Ko; Hiroto Narueda; Hisashi Suda; Akira Sugawara; 宏人 成枝; 章 菅原; 久 須田; 維林 高


Materials Transactions | 2011

Aging of Copper-Titanium Dilute Alloys in Hydrogen Atmosphere: Influence of Prior-Deformation on Strength and Electrical Conductivity *

Satoshi Semboshi; Shin-ichi Orimo; Hisashi Suda; Weilin Gao; Akira Sugawara

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Hiroshi Numakura

Osaka Prefecture University

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