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Dive into the research topics where Hitoshi Sakurai is active.

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Featured researches published by Hitoshi Sakurai.


Journal of the American Chemical Society | 2009

Rh(II)-Catalyzed Skeletal Reorganization of 1,6- and 1,7-Enynes through Electrophilic Activation of Alkynes

Kazusa Ota; Sang Ick Lee; Jhih-Meng Tang; Manabu Takachi; Hiromi Nakai; Tsumoru Morimoto; Hitoshi Sakurai; Ken Kataoka; Naoto Chatani

The skeletal reorganization of 1,6- and 1,7-enynes leading to 1-vinylcycloalkenes using Rh(II) as a catalyst is reported. Two possible isomers of 1-vinylcycloalkenes, type I and type II, can be obtained, the ratio of which are highly dependent on the substitution pattern of the enynes used. Formation of type I compounds involves a single cleavage of a C-C double bond, the product of which is identical to that of enyne metathesis. In contrast, the formation of type II compounds involves the double cleavage of both the C-C double and triple bonds, which has an anomalous bond connection. The presence of both a phenyl group at the alkyne carbon and a methyl group at the internal alkene carbon facilitates the formation of type II compounds. The electronic and steric nature of the substituents on the aromatic ring also affects the ratio of type I and type II. The nature of a tether also has a significant effect on the course of the reaction. Experimental evidence for the intermediacy of a cyclopropyl rhodium carbenoid, a key intermediate in the skeletal reorganization of enynes, is also reported. In addition to the skeletal reorganization of enynes, Rh(II) complexes were found to have a high catalytic activity for some cycloisomerization reactions of alkyne derivatives, including the bicyclization of enynes to bicyclo[4.1.0]heptene derivatives and the cyclization of alkynylfurans to phenol derivatives.


Archive | 2004

Solder deposition method and solder bump forming method

Youichi Kukimoto; Hitoshi Sakurai; Seishi Kumamoto; Kenshu Oyama


Journal of Electronic Materials | 2010

Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability

Hitoshi Sakurai; Alongheng Baated; Kiju Lee; Seongjun Kim; Keun-Soo Kim; Youichi Kukimoto; Seishi Kumamoto; Katsuaki Suganuma


Journal of Electronic Materials | 2008

Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound

Seishi Kumamoto; Hitoshi Sakurai; Youichi Kukimoto; Katsuaki Suganuma


Archive | 2011

SOLDERING PASTE FLUX AND SOLDERING PASTE

Teruyoshi Hamagawa; Youichi Kukimoto; Taku Hasegawa; Hitoshi Sakurai


Materials Transactions | 2005

Joints Soldered on Electroless Ni-Au Surfaces Using Cu-Containing Flux: Strength, Microstructure and Mechanism of Improvement

Seishi Kumamoto; Hitoshi Sakurai; Kazuki Ikeda; Katsuaki Suganuma


Microelectronics Reliability | 2012

Effects of Cu contents in flux on microstructure and joint strength of Sn–3.5Ag soldering with electroless Ni–P/Au surface finish

Hitoshi Sakurai; Keun-Soo Kim; Kiju Lee; Changjae Kim; Youichi Kukimoto; Katsuaki Suganuma


Transactions of The Japan Institute of Electronics Packaging | 2008

Flux for Stronger Solder Joints on Ni-P/Au Electrodes

Seishi Kumamoto; Hitoshi Sakurai; Youichi Kukimoto; Katsuaki Suganuma


Archive | 2012

Soldering tin paste composition and soldering-tin precoating method

Hitoshi Sakurai; Yoichi Kukimoto


Materials Transactions | 2010

Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish

Hitoshi Sakurai; Youichi Kukimoto; Seongjun Kim; Alongheng Baated; Kiju Lee; Keun-Soo Kim; Seishi Kumamoto; Katsuaki Suganuma

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