Ho-Shik Lee
Dongshin University
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Featured researches published by Ho-Shik Lee.
Transactions on Electrical and Electronic Materials | 2011
Ho-Shik Lee; Min-Woo Cheon; Yong-Pil Park
An organic field-effect transistor (OFET) was fabricated using a copper phthalocyanine (CuPc) as the active layer on the silicon substrate. The CuPc FET device was configured as a top-contact type. The substrate temperature was room temperature. The CuPc thickness was 40 nm, and the channel length and channel width were 100 μm 3 mm, respectively. Typical current-voltage (I-V) characteristics of the CuPc FET were observed and subsequently compared to the UV/ozone treatment on substrate surface.
Journal of The Korean Institute of Electrical and Electronic Material Engineers | 2009
Young-Pyo Kim; Tae-Gon Kim; Ho-Shik Lee; Yong-Pil Park; Min-Woo Cheon
X-ray system which is usefully used in diagnosis of the patient, being bombed of radioactivity is a big weak point when irradiates a X-ray to the human body so that ICRP restricted the radiation exposure tolerance of the human body. In order to reduce being bombed, the many research and development is now advanced. A lots of diagnostic X-ray machines have currently used due to the increase of occurrence efficiency of X-ray and precisely the output control by using the inverter which is a high speed switching semiconductors. For getting the confidence of the X-ray machine, the same radiation occurrence, same evaluation, and same irradiation condition are necessary when evaluates X-ray irradiation. It is the most important part for the accuracy of the test result and the patient safety. This research has produced the high voltage occurrence system of full-wave rectification method by using the LC resonance inverter, and evaluated the irradiation reproducibility in order to use it in diagnosis of the patient.
Journal of information and communication convergence engineering | 2015
Ho-Shik Lee; Seong-Geol Kim
In this study, organic field-effect transistors (OFETs) using a copper phthalocyanine (CuPc) material as an active layer and SiO₂ as a gate insulator were fabricated with varying active layer thicknesses and channel lengths. Further, using a thermal evaporation method in a high-vacuum system, we fabricated a CuPc FET device of the top-contact type and used Au materials for the source and drain electrodes. In order to discuss the channel formation and FET characteristics, we observed the typical current–voltage characteristics and calculated the threshold voltage of the CuPc FET device. We also found that the capacitance reached approximately 97 pF at a negative applied voltage and increased upon the accumulation of carriers at the interface of the metal and the CuPc material. We observed the typical behavior of a FET when used as an n-channel FET. Moreover, we calculated the threshold voltage to be about 15–20 V at V DS = –80 V.
Journal of The Korean Institute of Electrical and Electronic Material Engineers | 2011
Ho-Shik Lee; Min-Woo Cheon; Yong-Pil Park
Rhenium-Iridium(Re-Ir) thin films were deposited onto the tungsten carbide(WC) molding core by sputtering system. The Re-Ir films were prepared by multi-target sputtering with iridium, rhenium and chromium as the sources. Argon and nitrogen were inlet into the chamber to be the plasma and reactive gases. The Re-Ir thin films were prepared with targets having atomic percent of 3:7 and the Re-Ir thin films were formed with 240 nm thickness. The Re-Ir thin films on tungsten carbide molding core were analyzed by scanning electron microscope(SEM) and surface roughness. Also, adhesion strength and coefficient friction of Re-Ir thin film were examined. The Re-Ir coating technique has been intensive efforts in the field of coating process because the coating technique and process have been their feature, like hardness, high elasticity, abrasion resistance and mechanical stability and also have been applied widely the industrial and biomedical areas. In this report, tungsten carbide(WC) molding core was manufactures using high performance precision machining and the efforts of Re-Ir coating on the surface roughness.
Journal of The Korean Institute of Electrical and Electronic Material Engineers | 2011
Min-Woo Cheon; Yong-Pil Park; Tae-Gon Kim; Ho-Shik Lee
Department of Electrical and Electronic Engineering, Graduate School, Dongshin University, Naju 520-714, Korea(Received August 22, 2011; Revised September 9, 2011; Accepted September 14, 2011)Abstract: An optical lens is usually produced in the manner of high temperature compression molding with tungsten carbide alloy molding cores, it is necessary to develop and study technology for super-precision processing of molding cores and coating the core surface. As main methods used in surface improvement technologies using thin film, DLC present high hardness, chemical stability, and outstanding durability of abrasion to be extensively applied in various industrial fields. In this study, the effect of DLC coating of a thin film by means of the FVAS (filtered vacuum arc source) analyzed the characteristics of thin film. Surface roughness before and after DLC coating was measured and the result showed that the surface roughness was improved after coating as compared to before coating. In conclusion, it was observed that DLC coating of the ultra hard alloy core surface for molding had an effect on improving the surface roughness and shape of the core surface. It is considered that this will have an effect on improving abrasion resistance and the service life of the core surface.Keywords: Tungsten carbide, Diamond liked carbon, Thin film, Filtered vacuum arc source
Journal of The Korean Institute of Electrical and Electronic Material Engineers | 2008
Ho-Shik Lee; Yong-Pil Park; Min-Woo Cheon
Organic field-effect transistors (OFETs) are of interest for use in widely area electronic applications. We fabricated a copper phthalocyanine (CuPc) based field-effect transistor with different metal electrode. The CuPc FET device was made a top-contact type and the substrate temperature was room temperature. The source and drain electrodes were used an Au and Al materials. The CuPc thickness was 40 nm, and the channel length was , channel width was 3 mm. We observed a typical current-voltage (I-V) characteristics in CuPc FET with different electrode materials.
Journal of The Korean Institute of Electrical and Electronic Material Engineers | 2008
Ho-Shik Lee; Yong-Pil Park
Organic field-effect transistors (OFETs) are of interest for use in widely area electronic applications. We fabricated a copper phthalocyanine (CuPc) based field-effect transistor with different metal electrode. So we need the effect of the substituent group attached to the phthalocyanine on the surface potential was investigated by Kelvin probe method with varying temperature of the substrate. We were obtained the positive shift of the surface potential for CuPc thin film. We observed the electron displacement at the interface between Au electrode and CuPc layer and we were confirmed by the surface potential measurement.
Transactions on Electrical and Electronic Materials | 2007
Ho-Shik Lee; Seung-Ho Yang; Yong-Pil Park; Eunju Lim; Mitsumasa Iwamoto
【Organic field-effect transistor (FET) based on a copper Phthalocyanine (CuPc) material as an active layer and a
Journal of The Korean Institute of Electrical and Electronic Material Engineers | 2007
Ho-Shik Lee
SiO_2
Journal of The Korean Institute of Electrical and Electronic Material Engineers | 2006
Ho-Shik Lee; Hyen-Wook Kang; Kyung-Uk Jang; Young-Soo Kwon; Tae-Wan Kim; Mitsumasa Iwamoto; Won-Jae Lee
as a gate insulator were fabricated and analyzed. We measured the typical FET characteristics of CuPc in air. The electrical characteristics of the CuPc FET device were analyzed by a Maxwell-Wagner model. The Maxwell-Wagner model employed in analyzing double-layer dielectric system was helpful to explain the C-V and I-V characteristics of the FET device. In order to further clarity the channel formation of the CuPc FET, optical second harmonic generation (SHG) measurement was also employed. Interestingly, SHG modulation was not observed for the CuPc FET. This result indicates that the accumulation of charge from bulk CuPc makes a significant contribution.】