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Featured researches published by Holger Reinecke.


IEEE\/ASME Journal of Microelectromechanical Systems | 2013

Mechanical Characterization of Polycrystalline and Amorphous Silicon Carbide Thin Films Using Bulge Test

Sreedevi Maruthoor; Ajesh Ajayakumar; Tino Fuchs; Oleg Jakovlev; Holger Reinecke; Jürgen Wilde

This paper aims at determining the mechanical parameters such as Youngs modulus, Poissons ratio, and intrinsic stress of polycrystalline and amorphous silicon carbide thin films using the bulge test. A suitable method for the bulge test of highly compressive amorphous SiC films was devised by developing tensile composite layers involving a highly tensile substrate layer. A setup suitable for use in high temperatures was developed to hold membrane chips mechanically for applying pressure. The center deflection was measured with optical interferometry. The bulge test was done on square and rectangular membranes in order to ascertain the Poissons ratio and the exact Youngs modulus of the material. The tests in this paper were conducted at room temperature. The tensile polycrystalline SiC films were obtained by low-pressure chemical vapor deposition (LPCVD) at 825°C, using monomethylsilane as the precursor. The amorphous SiC (a-SiC) films were deposited by plasma enhanced chemical vapor deposition (PECVD) process at a temperature of 870°C with silane and acetylene as precursors. Test chips were pressurized from outside the membrane cavity, and membrane deflection was measured for each pressure step. The poly-SiC layers indicated a Youngs modulus of 280 GPa with a Poissons ratio of 0.237. The Youngs modulus of a-SiC films was found to be 232 GPa, but the Poissons ratio could not be determined as we used a composite layer. A comparison with the existing literature values of Youngs modulus was also done.


international conference on micro electro mechanical systems | 2015

Bonding mechanism in the Velcro concept Si-Si low temperature direct bonding technique

Shervin Keshavarzi; Ulrich Mescheder; Holger Reinecke

This work presents a bonding mechanism between needle-like surfaces for room temperature Si-Si direct bonding similar to the Velcro-principle, a fully CMOS compatible approach suitable for system integration using Si-motherboard concept. The proposed bonding model is superior to other presented models since it considers humidity effect and the deformation mechanism of the needles during the bonding.


Optical Systems Design 2015: Advances in Optical Thin Films V | 2015

Lamination of chemical incompatible optical polymer layers

Raimund Rother; Anne-Katrin Schuler; Claas Müller; Oswald Prucker; Jürgen Rühe; Holger Reinecke

The lamination process is a common method to generate polymer multilayer foils. However, the substrate materials used need to be miscible to give a stable connection. A typical set of incompatible polymers that is often used in optical applications is cyclic olefin copolymer (COC) and polymethylmethacrylate (PMMA). In this paper, we report about the development of a “Reactive Lamination Process” that is capable of forming a stable optical polymer multilayer of PMMA and COC. This paper focuses on the development of a spray coating process and the further processing with photoreactive PMMA copolymer systems that act as an unspecific primer to obtain optical polymer multilayer devices.


Archive | 2007

Surgical instrument e.g. scissors, for minimally invasive surgical procedure in patient, has piston sections with outer diameter smaller than inner diameter of shaft, and sealing element everted by formation of rolled sealing section

Alexander Disch; Theodor Lutze; Claas Müller; Holger Reinecke; Dirk Schauer


Archive | 2009

Resistive Hydrogen Sensor

Gilbert Dipl.-Ing. Erdler; Holger Reinecke; Claas Müller; Mirko Frank


Archive | 2014

FUEL CELL AND PROCES FOR MANUFACTURING A FUEL CELL

Mirko Lehmann; Claas Mueller; Holger Reinecke; Mirko Frank; Gilbert Erdler


Thin Solid Films | 2013

Improvement of process parameters for polycrystalline silicon carbide low pressure chemical vapor deposition on 150 mm silicon substrate using monomethylsilane as precursor

A. Ajayakumar; S. Maruthoor; Tino Fuchs; F. Rohlfing; Oleg Jakovlev; Jürgen Wilde; Holger Reinecke


Surface & Coatings Technology | 2018

Influence of silicon doping type on the adhesion of seedless electrodeposited copper layers

Frederico Lima; Ulrich Mescheder; G.L. Katona; H. Leiste; Emre Özel; Claas Müller; Holger Reinecke


Proceedings of the 4M/ICOMM2015 Conference | 2015

Evaluation of the Mechanical Properties of Non-Conductive Ceramics Machined with EDM using AE

Nirdesh Zeller; Nirdesh Ojha; Florian Zeller; Claas Müller; Holger Reinecke


Proceedings of the 4M/ICOMM2015 Conference | 2015

Influence of Pulse Width on Micro Electrical Discharge Machining of Non-Conductive Silicon Carbide

Florian Zeller; Nirdesh Ojha; Claas Müller; Holger Reinecke

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Mirko Frank

University of Freiburg

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