Hongjun Xu

Optimization design of grinding wheel topography for high efficiency grinding

Abstract In view of the limitation of prior topography models of the grinding wheel, a new method for optimization design of grinding wheel topography is advanced. The optimization model can be used to optimize the topography in accordance with machining demands and grinding parameters as well as optimize grinding parameters in accordance with the topography and machining demands. Furthermore, a superabrasive slotted grinding wheel is designed as a practical application of the optimization model and a creep-feed deep grinding experiment is carried out to verify the optimization results.

Interfacial reaction between cubic boron nitride and Ti during active brazing

Thermodynamic and reaction process analyses were performed to understand the joining characteristic during high temperature brazing between cubic boron nitride (CBN) grit and a silver-base filler alloy containing Ti as an active element. Experimental information on the microstructure of the brazed joint, the composition of the interface, and the shape of the compounds formed on the surface of the grit was obtained by scanning electron microscopy, energy-dispersive x-ray, and x-ray diffraction. The results indicate that Ti in the molten filler alloy facilitated good wetting between the solid CBN crystals and braze filler alloy. The transition layer formed by the interaction of TiN and TiB2 was one of the key factors in joining the CBN and steel substrate.

Force and Energy in Grinding Zirconia Ceramics by Brazed Monolayered Diamond Wheels

An investigation was undertaken to explore the grinding energy and removal mechanisms in grinding zirconia by using brazed diamond wheels. The grinding forces were measured and the morphological features of ground workpiece surfaces were examined. The results indicate that material removal mechanisms are dominated by the combined removal modes of brittle and ductile. The prevailing removal mechanism for the ground surface of zirconia changes from brittle to ductile when the maximum chip thickness change from large to small.