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Dive into the research topics where Howard E. Saunders is active.

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Featured researches published by Howard E. Saunders.


IEEE Spectrum | 1992

Conducting polymers

Karl F. Schoch; Howard E. Saunders

The fabrication of conducting polymers is briefly described. Advances in stability and processing characteristics, which have been the main barriers to the commercialization of these materials, are examined. The first commercial use of a conducting polymer in a 3 V, coin-sized primary battery is discussed. These batteries are compared with those produced using other technologies, and their possible applications are considered. Potential uses in electromagnetic interference (EMI) shielding, coatings, semiconductor devices, solar cells, and aircraft are discussed.<<ETX>>


electrical electronics insulation conference | 1989

Electrical properties of plasma polymerized thin films deposited at high substrate temperature

Rajender K. Sadhir; Howard E. Saunders; Karl F. Schoch; A.I. Bennett

The authors successfully prepared thin dielectric films containing silicon nitride-type linkages by plasma polymerization of tetramethylsilane in the presence of ammonia. The content of silicon nitride-type inorganic linkage in the polymer film increased with an increase in the substrate temperature from 25 degrees C to 200 degrees C. The rate of deposition of film decreased with an increase in substrate temperature. The dielectric constant and dissipation factor decreased with an increase in frequency. The loss tangent and dielectric constant decreased with an increase in the film deposition temperature from 25 degrees C to 200 degrees C at all the frequencies with an exception at the highest frequency. This has been attributed to the higher silicon nitride content in the films deposited at higher temperatures. A gradual increase in dielectric constant and loss tangent was observed for the films with an increase in measurement temperature. Aging of the plasma deposited films, both in air and oil, improved the dielectric properties. The DC resistivity increased with an increase in film deposition temperature. From these results it is concluded that, in general, the dielectric properties of plasma polymerized films can be improved by increasing the deposition temperature from ambient (which is commonly used) to 200 degrees C.<<ETX>>


Archive | 1976

Low dissipation factor electrostatic epoxy wire coating powder

Irving N Elbling; Howard E. Saunders


Archive | 1981

Solventless UV dryable B-stageable epoxy adhesive

George D. Dixon; Nancy W. Carlson; Howard E. Saunders


Archive | 1974

Method of making patterned dry resin coated sheet insulation

Edward J. Croop; Howard E. Saunders; Dean C. Westervelt


Archive | 1982

Arc and track resistant articles utilizing photosensitive sag resistant cycloaliphatic epoxy resin coating compositions

George D. Dixon; Howard E. Saunders; Smith A. Gause; Newton N Goldberg


Archive | 1976

Apparatus for making electrical coils using patterned dry resin coated sheet insulation

Edward J. Croop; Howard E. Saunders; Dean C. Westervelt


Archive | 1982

Insulated conductor having adhesive overcoat

Howard E. Saunders; Dean C. Westervelt; Irving N Elbling


Diamond and Related Materials | 1999

Gas recycling and flow control for cost reduction of diamond films deposited by DC arc-jet

Ivan A. Martorell; William D. Partlow; Robert M. Young; Jan Jozef Schreurs; Howard E. Saunders


Archive | 1979

Low dissipation factor epoxy coating powder

Howard E. Saunders; James D. B. Smith

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