Howard E. Saunders
Westinghouse Electric
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Publication
Featured researches published by Howard E. Saunders.
IEEE Spectrum | 1992
Karl F. Schoch; Howard E. Saunders
The fabrication of conducting polymers is briefly described. Advances in stability and processing characteristics, which have been the main barriers to the commercialization of these materials, are examined. The first commercial use of a conducting polymer in a 3 V, coin-sized primary battery is discussed. These batteries are compared with those produced using other technologies, and their possible applications are considered. Potential uses in electromagnetic interference (EMI) shielding, coatings, semiconductor devices, solar cells, and aircraft are discussed.<<ETX>>
electrical electronics insulation conference | 1989
Rajender K. Sadhir; Howard E. Saunders; Karl F. Schoch; A.I. Bennett
The authors successfully prepared thin dielectric films containing silicon nitride-type linkages by plasma polymerization of tetramethylsilane in the presence of ammonia. The content of silicon nitride-type inorganic linkage in the polymer film increased with an increase in the substrate temperature from 25 degrees C to 200 degrees C. The rate of deposition of film decreased with an increase in substrate temperature. The dielectric constant and dissipation factor decreased with an increase in frequency. The loss tangent and dielectric constant decreased with an increase in the film deposition temperature from 25 degrees C to 200 degrees C at all the frequencies with an exception at the highest frequency. This has been attributed to the higher silicon nitride content in the films deposited at higher temperatures. A gradual increase in dielectric constant and loss tangent was observed for the films with an increase in measurement temperature. Aging of the plasma deposited films, both in air and oil, improved the dielectric properties. The DC resistivity increased with an increase in film deposition temperature. From these results it is concluded that, in general, the dielectric properties of plasma polymerized films can be improved by increasing the deposition temperature from ambient (which is commonly used) to 200 degrees C.<<ETX>>
Archive | 1976
Irving N Elbling; Howard E. Saunders
Archive | 1981
George D. Dixon; Nancy W. Carlson; Howard E. Saunders
Archive | 1974
Edward J. Croop; Howard E. Saunders; Dean C. Westervelt
Archive | 1982
George D. Dixon; Howard E. Saunders; Smith A. Gause; Newton N Goldberg
Archive | 1976
Edward J. Croop; Howard E. Saunders; Dean C. Westervelt
Archive | 1982
Howard E. Saunders; Dean C. Westervelt; Irving N Elbling
Diamond and Related Materials | 1999
Ivan A. Martorell; William D. Partlow; Robert M. Young; Jan Jozef Schreurs; Howard E. Saunders
Archive | 1979
Howard E. Saunders; James D. B. Smith