Huakang Bian

Superthermostability of nanoscale TIC-reinforced copper alloys manufactured by a two-step ball-milling process

A Cu-TiC alloy, with nanoscale TiC particles highly dispersed in the submicron-grained Cu matrix, was manufactured by a self-developed two-step ball-milling process on Cu, Ti and C powders. The thermostability of the composite was evaluated by high-temperature isothermal annealing treatments, with temperatures ranging from 727 to 1273 K. The semicoherent nanoscale TiC particles with Cu matrix, mainly located along the grain boundaries, were found to exhibit the promising trait of blocking grain boundary migrations, which leads to a super-stabilized microstructures up to approximately the melting point of copper (1223 K). Furthermore, the Cu-TiC alloys after annealing at 1323 K showed a slight decrease in Vickers hardness as well as the duplex microstructure due to selective grain growth, which were discussed in terms of hardness contributions from various mechanisms.

Detwining in Mg alloy with a high density of twin boundaries

Abstract To investigate the role of preexisting twin boundaries in magnesium alloys during the deformation process, a large number of {10-12} tensile twins were introduced by a radial compression at room temperature before hot compressive tests with both low and high strain rates. Unlike the stable twins in Cu-based alloys with low stacking fault energies, {10-12} twins in Mg alloy are extremely unstable or easy to detwin through {10-12}-{10-12} re-twinning. As a result, non-lenticular residual twins and twin traces with misorientation of 5°–7° were present, as confirmed by electron backscatter diffraction. The extreme instability of the twins during compression indicates that both twin and detwinning require extremely low resolved shear stresses under our experimental conditions.

Effects of surface friction treatment on the in vitro release of constituent metals from the biomedical Co-29Cr-6Mo-0.16N alloy.

Due to the ignorance by many researchers on the influence of starting microstructure on the metal release of biomedical materials in human body after implant, in this study, the effect of surface friction treatment on the in vitro release of the constituent elements of the biomedical Co-29Cr-6Mo-0.16N (CCM) alloy is investigated for the first time by immersion test in lactic acid solution combined with electron backscatter diffraction, transmission electron microscope, X-ray diffraction, X-ray photoelectron spectroscopy, and inductively coupled plasma atomic emission spectroscopy (ICP-EOS). The results indicate that friction treatment on the as-annealed CCM alloy sample surface leads to a planar strain-induced martensitic transformation (SIMT) on sample surface; this greatly accelerates the release of all the constituent elements and, in particular, that of Co as indicated by the ICP-EOS analysis. This increase can be ascribed to a localized deformation that occurred over the entire sample surface, with the dislocation density being high within the SIMTed phase and low in the alloy matrix.

Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder

The electrical conductivity of pure Cu powder is typically deteriorated at elevated temperatures due to the oxidation by forming non-conducting oxides on surface, while enhancing oxidation resistance via alloying is often accompanied by a drastic decline of electrical conductivity. Obtaining Cu powder with both a high electrical conductivity and a high oxidation resistance represents one of the key challenges in developing next-generation electrical transferring powder. Here, we fabricate a Cu-Ag powder with a continuous Ag network along grain boundaries of Cu particles and demonstrate that this new structure can inhibit the preferential oxidation in grain boundaries at elevated temperatures. As a result, the Cu-Ag powder displays considerably high electrical conductivity and high oxidation resistance up to approximately 300 °C, which are markedly higher than that of pure Cu powder. This study paves a new pathway for developing novel Cu powders with much enhanced electrical conductivity and oxidation resistance in service.