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Huang Jian-Ping

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Publication

Featured researches published by Huang Jian-Ping.

Archive | 2004

Semiconductor packaging member having heat dissipation plate

Huang Jian-Ping; He Tzung-Da; Shiau Cheng-Shiu

Archive | 2002

Semiconductor encapsulation with stacked chips

Huang Jian-Ping; He Tzung-Da; Shiau Cheng-Shiu

Archive | 2000

Dual-chip semiconductor package device having malposition and the manufacture method thereof

Huang Jian-Ping; Jiang Lian-Cheng; Jang Je-Rung

Archive | 2003

Quad flat non-leaded semiconductor package structure and manufacturing process

Chen Nan-Jang; Jiang Wen-Rung; Huang Jian-Ping; He Tzung-Da

Archive | 2002

Packaging method for preventing a low viscosity encapsulant from flashing

Huang Jian-Ping; He Tzung-Da

Archive | 2002

Semiconductor package with enhanced heat-dissipation efficiency

He Tzung-Da; Huang Jian-Ping

Archive | 2002

Wafer level semiconductor package structure having high heat dissipation function and the process thereof

He Tzung-Da; Huang Jian-Ping

Archive | 2002

BGA semiconductor packaged-component with embedded heat dissipation member

He Tzung-Da; Huang Jian-Ping

Archive | 2002

Semiconductor package having chip cracking prevention member

Huang Jian-Ping; He Tzung-Da

Archive | 2002

Manufacturing method for semiconductor package with heat sink

Huang Jian-Ping; He Tzung-Da; Shiau Cheng-Shiu

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Collaboration

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