Hyun-Aee Chun

Cure Properties of Naphthalene-Based Epoxy Resin Systems with Hardeners and Latent Catalysts for Semiconductor Packaging Materials

The cure properties of naphthalene-based epoxy resin (EXA-4700) systems with different hardeners and latent catalysts were investigated. The latent catalysts used in this study were tetraphenyl phosphonium-thiocyanate (TPP-SCN) and 2-ethyl-4-methyl imidazolium tetraphenyl borate (EMZ-K). The cure kinetics of these systems were analyzed by dynamic and isothermal data from the Differential Scanning Calorimetry (DSC) experiments, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. Thermal expansion coefficients of these epoxy systems were obtained by mean of Thermo Mechanical Analyzer (TMA) measurement. The conversion reaction rate of EXA-4700 system with TPP-SCN is higher than that with EMZ-K, irrespective of the location of hydroxyl group in naphthol hardeners or the differences in cure mechanisms between these latent catalysts. The thermal expansion coefficient in low temperature region (α1) of EXA-4700 resin systems with 2,7-naphthol as a hardener is lower than that with 1,6-naphthol. The cure properties of these epoxy resin systems with different hardeners and catalysts were investigated with respect to the curing molecular structure.

Cure properties of alkoxysilylated epoxy resin systems with hardeners for semiconductor packaging materials

ABSTRACT The alkoxysilylated bisphenol A epoxy resins, dsiglycidylether of bisphenol A with 3-triethoxysilyl propyl carbamate(DGEBA-TESPC) and diglycidyl ether of bisphenol A with 3-triethoxysilyl propyl(DGEBA-TESP) are synthesized, and the effect of alkoxysilyl group on the cure properties of these resin systems with phenol novolac(PN) hardener and triphenylphosphine(TPP) catalyst are investigated. The cure kinetics of these systems were analyzed by dynamic and isothermal data from the DSC experiments, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. Thermal expansion coefficients of these epoxy systems were obtained by mean of TMA measurement. These resin systems show autocatalytic cure kinetics phenomena and the conversion reaction rate of DGEBA-TESP hybrid system with PN hardener is slightly higher than DGEBA-TESPC system. The DGEBA-TESP resin system has lower frequency factor and lower activation energy than DGEBA-TESPC resin system in k1 reaction rate constant. However, it shows higher frequency factor and higher activation energy than that in k2 reaction rate constant. The thermal property of glass fiber composites of DGEBA-TESPC and DGEBA-TESP is observed to be improved than DGEBA, which may arise from the facile interaction of grafted alkoxysilyl group with glass fiber.