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Dive into the research topics where Hyun-kyu Yun is active.

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Featured researches published by Hyun-kyu Yun.


Journal of Adhesion Science and Technology | 1998

Adhesion improvement of epoxy resin/copper lead frame j oints by azole compounds

S.M. Song; C.E. Park; Hyun-kyu Yun; Chan Hwang; Seunghee Oh; Jungsik Park

The adhesion strength of epoxy resin/copper joints is often very poor, due to the naturally formed copper oxide having a low mechanical strength. To improve the adhesion strength of epoxy resin/copper lead frame joints, copper lead frames were treated with azole compounds as adhesion promoters. The azole compounds used were benzotriazole (BTA), benzotriazole-5-carboxylic acid (CBTA), 8-azaadenine, imidazole, 2-methyl imidazole, urocanic acid, adenine, benzimidazole, and polybenzimidazole (PBI). The dependence of the adhesion strength of epoxy resin/azole-treated copper joints on the structure of the azole compound, the azole treatment time, and the azole treatment temperature was investigated. The surface coverage of azole-treated copper was examined by contact angle measurements, a surface defect test, optical microscopy, and scanning electron microscopy (SEM), and the locus of failure was studied by X-ray photoelectron spectroscopy (XPS). Triazole compounds such as CBTA and 8-azaadenine showed excellent...


Journal of Adhesion Science and Technology | 1997

Adhesion improvement of epoxy resin to alloy 42 lead frame by silane coupling agents

S.M. Song; C.E. Park; Hyun-kyu Yun; Seunghee Oh; Jungsik Park

Three different silane coupling agents were used to improve the adhesion between epoxy resin and alloy 42 lead frame. The adhesion strength and durability of epoxy resin/silane coupling agent-treated alloy 42 joints were investigated. The highest initial adhesion strength, 200 N/m, was obtained with γ-aminopropyltriethoxysilane (y-APS), but durability in a high humidity environment was best with N-,β-(aminoethyl)-y-aminopropyltrimethoxysilane (AAMS). An optimum concentration of the silane coupling agent was determined and thermal stability was studied by thermogravimetric analysis (TGA). Vapor phase deposition of the AAMS silane coupling agent was also employed and compared with dipping of the lead frame in the silane coupling agent solution. Moisture absorption behavior was examined for different silane coupling agents and for different geometries of the joints to resolve the moisture absorption path of joints. The improvement in adhesion obtained by applying a silane coupling agent to the lead frame can...


Journal of Adhesion Science and Technology | 1997

Effects of plasma treatment of polyimide on the adhesion strength of epoxy resin / polyimide j oints

Hyun-kyu Yun; Kyung-Mox Cho; Jong Kyu Kim; C.E. Park; S.M. Sim; Sang-Kyu Oh; Jong-woo Park


Archive | 2011

Display system, display apparatus and control method thereof

Seung-Bok Lee; Hyun-kyu Yun; Geun-sam Yang


Archive | 2004

DSP (digital signal processing) architecture with a wide memory bandwidth and a memory mapping method thereof

Hyun-kyu Yun; Han-Tak Kwak


Journal of Applied Polymer Science | 2002

Synthesis and characterization of water-soluble polymeric adhesion promoter for epoxy resin/copper joints

S. M. Song; Kyung-Mox Cho; C.E. Park; Hyun-kyu Yun; Seunghee Oh


Archive | 2013

REMOTE CONTROL FOR SENSING MOVEMENT, IMAGE DISPLAY APPARATUS FOR CONTROLLING POINTER BY THE REMOTE CONTROL, AND CONTROLLING METHOD THEREOF

Hyun-kyu Yun


Archive | 2014

Method for providing graphical user interface for changing reproducing time point and imaging apparatus therefor

Young-hwa Yun; Seong-ick Jon; Joon-Hwan Kim; Jeong-yeon Lee; Woo-seok Hwang; Hyun-kyu Yun


Archive | 2012

DISPLAY APPARATUS AND METHOD FOR EXECUTING LINK AND METHOD FOR RECOGNIZING VOICE THEREOF

Eun-Sang Bak; Hyun-kyu Yun


Archive | 2013

Electronic apparatus and method for controlling electronic apparatus thereof

Namgook Cho; Ki-Beom Kim; Jeong-Su Kim; Hyun-kyu Yun

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C.E. Park

Pohang University of Science and Technology

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