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Featured researches published by Isao Tsukagoshi.


Archive | 1987

Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained

Isao Tsukagoshi; Yutaka Yamaguchi; Atsuo Nakajima; Yoshikatsu Mikami; Kuniteru Muto; Yoshiyuki Ikezoe


Archive | 1989

Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips

Isao Tsukagoshi; Yutaka Yamaguchi; Atsuo Nakajima; Yasushi Goto


Archive | 1995

Process for connecting circuits and adhesive film used therefor

Isao Tsukagoshi; Yutaka Yamaguchi; Atsuo Nakajima; Yasushi Goto


Archive | 1991

Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits

Isao Tsukagoshi; Yutaka Yamaguchi; Atsuo Nakajima; Yasushi Goto


Archive | 1996

Semiconductor device having a semiconductor chip electrically connected to a wiring substrate

Isao Tsukagoshi; Hiroshi Matsuoka; Yukihisa Hirosawa; Yoshikatsu Mikami; Hisashi Dokochi


Archive | 1986

Anisotropic-electroconductive adhesive film

Isao Tsukagoshi; Yutaka Yamaguchi; Tadamitsu Nakayama


Archive | 1997

Anisotropically electroconductive resin film

Yasushi Goto; Isao Tsukagoshi; Tomohisa Ohta


Archive | 1996

Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet

Isao Tsukagoshi; Yukihisa Hirosawa; Kouji Kobayashi; Tomohisa Ohta; Hiroshi Matsuoka; Itsuo Watanabe; Kenzo Takemura; Naoyuki Shiozawa; Osamu Watanabe; Kazuyoshi Kojima


Archive | 2009

CONDUCTOR CONNECTION MEMBER, CONNECTION STRUCTURE, AND SOLAR CELL MODULE

Naoki Fukushima; Isao Tsukagoshi; Takehiro Shimizu


Archive | 1997

Method of mounting a plurality of electronic parts on a circuit board

Isao Tsukagoshi; Kouji Kobayashi; Kazuya Matsuda; Naoki Fukushima; Jyunichi Koide

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