J.A. Roussos

Improved reliability of AlGaN-GaN HEMTs using an NH/sub 3/ plasma treatment prior to SiN passivation

A passivation method has been developed which reduces the degradation of AlGaN-GaN high electron mobility transistor (HEMT) electrical properties caused by extended dc bias or microwave power operation. The key aspect of this passivation technique is exposure to a low-power NH/sub 3/ plasma prior to SiN deposition. Devices fabricated with the NH/sub 3/ treatment prior to SiN passivation show minimal gate lag and current collapse after extended dc bias operation. In addition, the rate of degradation of the microwave power output while under continuous microwave operation is improved by at least 100 times as compared to SiN passivated HEMTs that were not treated with the NH/sub 3/ plasma.

Current collapse induced in AlGaN/GaN high-electron-mobility transistors by bias stress

Current collapse is observed to be induced in AlGaN/GaN high-electron-mobility transistors as a result of short-term bias stress. This effect was seen in devices grown by both metalorganic chemical vapor deposition (MOCVD) and molecular-beam epitaxy (MBE). The induced collapse appears to be permanent and can be reversed by SiN passivation. The traps responsible for the collapse have been studied by photoionization spectroscopy. For the MOCVD-grown devices, the same traps cause the collapse in both unstressed and stressed devices. These effects are thought to result from hot-carrier damage during stress.

Full-Wafer Characterization of AlGaN/GaN HEMTs on Free-Standing CVD Diamond Substrates

We report on electrical characterization and uniformity measurements of the first conventionally processed AlGaN/GaN high electron mobility transistors (HEMTs) on free-standing chemical-vapor-deposited (CVD) diamond substrate wafers. DC and RF device performance is reported on HEMTs fabricated on ~ 130-¿m-thick and 30-mm round CVD diamond substrates without mechanical carrying wafers. A measured fT ·LG product of 12.5 GHz ·¿m is the best reported data for all GaN-on-diamond technology. X-band power performance of AlGaN/GaN HEMTs on diamond is reported to be 2.08 W/mm and 44.1% power added efficiency. This letter demonstrates the potential for GaN HEMTs to be fabricated on CVD diamond substrates utilizing contact lithography process techniques. Further optimization of the epitaxy and diamond substrate attachment process could provide for improvements in thermal spreading while preserving the electrical properties.

Molecular beam epitaxy of beryllium-doped GaN buffer layers for AlGaN/GaN HEMTs

Group III-nitride semiconductors are promising materials for high-power microwave transistors. However, several materials issues remain to be solved. For example, conducting buffer or interfacial layers are a frequently observed problem in AlGaN/GaN HEMTs grown by both MOCVD and MBE. These conducting layers can cause poor pinch-off characteristics and poor inter-device isolation.

High Electron Velocity Submicrometer AlN/GaN MOS-HEMTs on Freestanding GaN Substrates

AlN/GaN heterostructures with 1700-cm²/V·s Hall mobility have been grown by molecular beam epitaxy on freestanding GaN substrates. Submicrometer gate-length (L_G) metal-oxide-semiconductor (MOS) high-electron-mobility transistors (HEMTs) fabricated from this material show excellent dc and RF performance. L_G = 100 nm devices exhibited a drain current density of 1.5 A/mm, current gain cutoff frequency f_T of 165 GHz, a maximum frequency of oscillation f_max of 171 GHz, and intrinsic average electron velocity v_e of 1.5 ×10⁷ cm/s. The 40-GHz load-pull measurements of L_G = 140 nm devices showed 1-W/mm output power, with a 4.6-dB gain and 17% power-added efficiency. GaN substrates provide a way of achieving high mobility, high v_e, and high RF performance in AlN/GaN transistors.

Large-Signal RF Performance of Nanocrystalline Diamond Coated AlGaN/GaN High Electron Mobility Transistors

In this split-wafer study, we have compared the dc, pulsed, small and large signal RF electrical performance of nanocrystalline diamond (NCD) coated AlGaN/GaN high electron mobility transistors (HEMTs) to reference devices with silicon nitride passivation only. The NCD-coated HEMTs were observed to outperform reference devices in transconductance, large-signal gain, output power density, and power-added efficiency at 4 GHz. The measured improvements were suspected to be related to reduced dispersion and lower source access resistance afforded by the NCD film.

Accelerated life testing and failure analysis of single stage MMIC amplifiers

Single stage monolithic microwave integrated circuit (MMIC) amplifiers have been high temperature accelerated life tested under DC+RF biasing conditions. Most of the circuits failed parametrically due to a gradual decrease in RF output power. Failure analysis revealed localized reduction of the gate breakdown characteristics of the metal semiconductor field effect transistor (MESFET). This was occurring through degradation of the GaAs surface Si/sub 3/N/sub 4/ passivation layer interface in the channel region of the MESFET, resulting in a reduction in the number of surface states. The few catastrophically failed MMICs are believed to represent a special case of this degradation process which occurred very rapidly. In contrast to the transistor, the other components of the circuits were unchanged following life test. >

Quantitative measurement of channel temperature of GaAs devices for reliable life-time prediction

The channel temperature of Gallium Arsenide (GaAs) devices was quantitatively measured using scanning thermal microscopy (SThM), which is a variation of atomic force microscopy (AFM). The temperature of the devices was also characterized by infrared (IR) imaging and thermal modeling. The measured SThM temperature values were close to the calculated values from the model, and were higher than those found by IR, as predicted. In contrast to most published AFM results which have reported only qualitative and indirect semi-quantitative thermal information about the sample, the results presented here can be used directly to determine accurately the device-temperature. These results are useful to the reliability community in that they help to predict a more accurate semiconductor device lifetime. By careful calibration of an AFM thermistor probe tip, a quantitative temperature measurement of the channel temperature of the GaAs PHEMTs and MESFETs can be made. The result of the measurement can be substantiated by applying a suitable thermal calculation, such as the Cooke model. A secondary measurement technique, such as IR microscopy, can also be useful in providing further information about the thermal response of the device. Published results using AFM techniques have been unable to determine the channel temperature quantitatively. The method in this paper applies to other types of electronic devices for which the channel (or junction) temperature can be probed from the top surface of the device.

Life testing and failure analysis of PHEMT MMICs

Accelerated high temperature RF life testing was used to investigate the reliability of two-stage GaAs MMIC power amplifiers based on 0.25 m PHEMT technology. Life testing was performed at elevated baseplate temperatures with MMICs operating at typical DC bias conditions and large signal RF drive levels of two dB compression. The resulting failure distribution was log normal and the estimated median life time extrapolated to a channel temperature of 140 C was 2.3x10/sup 6/ hours with an activation energy of 1.1 eV.

Current collapse induced in AlGaN/GaN HEMTs by short-term DC bias stress

GaN HEMTs grown by MOCVD and by MBE were subjected to short term bias-stress. Current collapse was found to be induced in most of the devices after stress, apparently caused by the generation or activation of trapping centers.