J. Fleming Dias
Hewlett-Packard
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Featured researches published by J. Fleming Dias.
Journal of the Acoustical Society of America | 1999
J. Fleming Dias; Mir Said Seyed-Bolorforosh
A method of forming an impedance matching layer of an acoustic transducer includes geometrically patterning impedance matching material directly onto a radiating surface of piezoelectric substrate. In one embodiment, the matching layer is deposited onto the piezoelectric substrate and photolithographic techniques are utilized to pattern the matching layer to provide posts tailored to better match the piezoelectric substrate to a medium into which acoustic waves are to be transmitted. A nominal layer of metal between the posts and the piezoelectric substrate improves the attachment of the matching material to the substrate. The nominal layer may be chrome-gold and the matching material may be copper. Typically, the radiating surface is the substrate front surface from which acoustic waves are directed into a medium of interest, e.g., water or human tissue. However, the radiating surface may be the substitute rear surface, with the patterned matching layer providing acoustic matching to a backing layer for absorbing acoustic energy. In another embodiment, matching layers of different acoustic impedances are deposited and patterned on both the front and rear surfaces to provide matching for effective transmission into the medium of interest and into an acoustic absorptive backing medium.
Ultrasonic Imaging | 1981
J. Fleming Dias
A technique for electrically connecting to the PZT elements in a phased array transducer of a cardiac imaging probe is described. The transducer is a stack consisting of a PZT substrate with metallized faces and is bonded to an acoustic absorber across a thin alumina substrate of proper acoustic impedance. The PZT substrate is sawed into an array of elements and a metal foil with an integrally moulded acoustic lens is bonded to the tops of the elements to form the common ground connection. The transducer stack is enclosed in an alumina box and the electrical connection to the PZT elements is made by silk-screened metallic conductors on the sides of the box. The stack transducer module is enclosed in a two part linen bakelite case which is sealed by injecting silicone rubber. A technique that was used to prepare the surface of the acoustic absorber, which resulted in wide bandwidth transducers, is described. Finally, we show the pulse-echo response of the completed transducer imaging a point target in water.
Archive | 1992
King-Wah W. Yeung; J. Fleming Dias
Archive | 1992
J. Fleming Dias
Archive | 1996
J. Fleming Dias; Hewlett E. Melton
Archive | 1974
J. Fleming Dias; Henry E. Karrer
Archive | 1993
J. Fleming Dias; Hewlett E. Melton
Journal of the Acoustical Society of America | 1994
J. Fleming Dias; Hewlett E. Melton
Archive | 1976
J. Fleming Dias; Henry E. Karrer; Alexander Tykulsky
Ultrasonic Imaging | 1982
J. Fleming Dias