J. Grandal

Coaxial multishell (In,Ga)As/GaAs nanowires for near-infrared emission on Si substrates.

Efficient infrared light emitters integrated on the mature Si technology platform could lead to on-chip optical interconnects as deemed necessary for future generations of ultrafast processors as well as to nanoanalytical functionality. Toward this goal, we demonstrate the use of GaAs-based nanowires as building blocks for the emission of light with micrometer wavelength that are monolithically integrated on Si substrates. Free-standing (In,Ga)As/GaAs coaxial multishell nanowires were grown catalyst-free on Si(111) by molecular beam epitaxy. The emission properties of single radial quantum wells were studied by cathodoluminescence spectroscopy and correlated with the growth kinetics. Controlling the surface diffusivity of In adatoms along the NW side-walls, we improved the spatial homogeneity of the chemical composition along the nanowire axis and thus obtained a narrow emission spectrum. Finally, we fabricated a light-emitting diode consisting of approximately 10(5) nanowires contacted in parallel through the Si substrate. Room-temperature electroluminescence at 985 nm was demonstrated, proving the great potential of this technology.

Plan-view transmission electron microscopy investigation of GaAs/(In,Ga)As core-shell nanowires

Plan-view transmission electron microscopy in combination with electron energy-loss spectroscopy have been used to analyze the strain and the chemical composition of GaAs/(In,Ga)As core-shell nanowires. The samples consist of an GaAs core and a radially arranged (In,Ga)As layer as quantum well and GaAs outer-shell. The nominal parameters of the quantum well in the two samples under investigation are: an indium concentration of 25% and a quantum well thickness of 22 nm and 11 nm, respectively, while the core and the external shell dimensions are fixed. Scanning transmission electron microscopy using high-angle annular dark field detector was performed to verify the actual dimensions of the layers. Geometric phase analysis was carried out in order to examine the local strain of the radial (In,Ga)As quantum well, while the local chemical composition was determined by means of spatially resolved electron energy-loss spectroscopy. Finite elements calculations were carried out in order to simulate the multi-she...

Volume charge carrier number fluctuations probed by low frequency noise measurements in InN layers

Bulk conduction in molecular beam epitaxial InN layers has been confirmed using low frequency noise measurements versus temperature. A generation-recombination process has been identified at low temperatures 100 K and attributed to a trap with a discrete energy level in the band gap. The energy position of this trap has been determined to be around 52 meV below the conduction band minimum.

Investigation of III–V Nanowires by Plan-View Transmission Electron Microscopy: InN Case Study

We discuss observations of InN nanowires (NWs) by plan-view high-resolution transmission electron microscopy (TEM). The main difficulties arise from suitable methods available for plan-view specimen preparation. We explore different approaches and find that the best results are obtained using a refined preparation method based on the conventional procedure for plan-view TEM of thin films, specifically modified for the NW morphology. The fundamental aspects of such a preparation are the initial mechanical stabilization of the NWs and the minimization of the ion-milling process after dimpling the samples until perforation. The combined analysis by plan-view and cross-sectional TEM of the NWs allows determination of the degree of strain relaxation and reveals the formation of an unintentional shell layer (2-3-nm thick) around the InN NWs. The shell layer is composed of bcc In2O3 nanocrystals with a preferred orientation with respect to the wurtzite InN: In2O3 [111] || InN [0001] and In2O3<110>||InN<1120>.

Influence of fabrication steps on optical and electrical properties of InN thin films

This paper reports on a case study of the impact of fabrication steps on InN material properties. We discuss the influence of annealing time and sequence of device processing steps. Photoluminescence (PL), surface morphology and electrical transport (electrical resistivity and low frequency noise) properties have been studied as responses to the adopted fabrication steps. Surface morphology has a strong correlation with annealing times, while sequences of fabrication steps do not appear to be influential. In contrast, the optical and electrical properties demonstrate correlation with both etching and thermal annealing. For all the studied samples PL peaks were in the vicinity of 0.7 eV, but the intensity and full width at half maximum (FWHM) demonstrate a dependence on the technological steps followed. Sheet resistance and electrical resistivity seem to be lower in the case of high defect introduction due to both etching and thermal treatments. The same effect is revealed through 1/f noise level measurements. A reduction of electrical resistivity is connected to an increase in 1/f noise level.

Effect of different buffer layers on the quality of InGaN layers grown on Si

This work studies the effect of four different types of buffer layers on the structural and optical properties of InGaN layers grown on Si(111) substrates and their correlation with electrical characteristics. The vertical electrical conduction of n-InGaN/buffer-layer/p-Si heterostructures, with In composition near 46%, which theoretically produces an alignment of the bands, is analyzed. Droplet elimination by radical-beam irradiation was successfully applied to grow high quality InGaN films on Si substrates for the first time. Among several buffer choices, an AlN buffer layer with a thickness above 24 nm improves the structural and optical quality of the InGaN epilayer while keeping a top to bottom ohmic behavior. These results will allow fabricating double-junction InGaN/Si solar cells without the need of tunnel junctions between the two sub-cells, therefore simplifying the device design.This work studies the effect of four different types of buffer layers on the structural and optical properties of InGaN layers grown on Si(111) substrates and their correlation with electrical characteristics. The vertical electrical conduction of n-InGaN/buffer-layer/p-Si heterostructures, with In composition near 46%, which theoretically produces an alignment of the bands, is analyzed. Droplet elimination by radical-beam irradiation was successfully applied to grow high quality InGaN films on Si substrates for the first time. Among several buffer choices, an AlN buffer layer with a thickness above 24 nm improves the structural and optical quality of the InGaN epilayer while keeping a top to bottom ohmic behavior. These results will allow fabricating double-junction InGaN/Si solar cells without the need of tunnel junctions between the two sub-cells, therefore simplifying the device design.

High Resolution Studies of Oxide Multiferroic Interfaces in the Aberration-Corrected STEM

1. GFMC, Dept. de Fisica de Materiales, Universidad Complutense de Madrid, 28040 Madrid, Spain. 2. University of Tokyo, Tokyo 113-8656, Japan. 3. Instituto de Ciencia de Materiales de Madrid, Consejo Superior de Investigaciones Científicas. Cantoblanco 280409, Madrid. Spain. 4. Instituto de Magnetismo Aplicado, Universidad Complutense de Madrid, 28040 Madrid, Spain. 5. Department of Materials Science & Engineering, National University of Singapore, Singapore 117575.

Evidence of charge carrier number fluctuations in InN thin films

Due to its small band-gap and its high mobility, InN is a promising material for a large number of key applications like band-gap engineering for high efficiency solar cells, light emitting diodes, and high speed devices. Unfortunately, it has been reported that this material exhibits strong surface charge accumulation which may depend on the type of surface. Current investigations are conducted in order to explain the mechanisms which govern such a behavior and to look for ways of avoiding it and/or finding applications that may use such an effect. In this framework, low frequency noise measurements have been performed at different temperatures on patterned MBE grown InN layers. The evolution of the 1/f noise level with temperature in the 77 K-300 K range is consistent with carrier number fluctuations thus indicating surface mechanisms: the surface charge accumulation is confirmed by the noise measurements.