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Featured researches published by J.L. Du.


Science and Technology of Advanced Materials | 2018

Detwinning through migration of twin boundaries in nanotwinned Cu films under in situ ion irradiation

J.L. Du; Zaoming Wu; Engang Fu; Yanxiang Liang; Xingjun Wang; Peipei Wang; Kaiyuan Yu; Xiangdong Ding; Meimei Li; M. A. Kirk

Abstract The mechanism of radiation-induced detwinning is different from that of deformation detwinning as the former is dominated by supersaturated radiation-induced defects while the latter is usually triggered by global stress. In situ Kr ion irradiation was performed to study the detwinning mechanism of nanotwinned Cu films with various twin thicknesses. Two types of incoherent twin boundaries (ITBs), so-called fixed ITBs and free ITBs, are characterized based on their structural features, and the difference in their migration behavior is investigated. It is observed that detwinning during radiation is attributed to the frequent migration of free ITBs, while the migration of fixed ITBs is absent. Statistics shows that the migration distance of free ITBs is thickness and dose dependent. Potential migration mechanisms are discussed.


International Journal of Refractory Metals & Hard Materials | 2017

Refinement process and mechanisms of tungsten powder by high energy ball milling

Y.X. Liang; Zaoming Wu; E.G. Fu; J.L. Du; Peipei Wang; Yunbiao Zhao; Y.H. Qiu; Z.Y. Hu


Acta Materialia | 2017

The temperature and size effect on the electrical resistivity of Cu/V multilayer films

Pingzhang Wang; Xinqiang Wang; J.L. Du; Feng Ren; Youyi Zhang; X. Zhang; E.G. Fu


Powder Technology | 2018

The ball to powder ratio (BPR) dependent morphology and microstructure of tungsten powder refined by ball milling

Zaoming Wu; Y.X. Liang; Y. Fan; Peipei Wang; J.L. Du; Yunbiao Zhao; E.G. Fu


Applied Surface Science | 2018

The study on the electrical resistivity of Cu/V multilayer films subjected to helium (He) ion irradiation

Pingzhang Wang; C. Xu; E.G. Fu; J.L. Du; Yuan Gao; Xinqiang Wang; Y.H. Qiu


Scripta Materialia | 2017

Insight into the impact of nanovoids on the electrical and mechanical properties of nanotwinned copper films

Z.Y. Hu; J.L. Du; Pingzhang Wang; Xinqiang Wang; Youyi Zhang; Y.H. Qiu; E.G. Fu


Powder Technology | 2018

The process and mechanisms for the transformation of coarse grain to nanoscale grain in tungsten by ball milling

Zhongzhen Wu; Y.X. Liang; E.G. Fu; J.L. Du; Pingzhang Wang


Metals | 2018

Effect of Ball Milling Parameters on the Refinement of Tungsten Powder

Zaoming Wu; Y.X. Liang; Engang Fu; J.L. Du; Peipei Wang; Yong Fan; Yunbiao Zhao


Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2018

A novel approach to extracting hardness of copper/niobium (Cu/Nb) multilayer films by removing the substrate effect

Y.H. Qiu; Q. Bai; E.G. Fu; Pingzhang Wang; J.L. Du; Xiaodian Chen; Jianming Xue; Yugang Wang; Xinqiang Wang


Intermetallics | 2018

Mechanisms for the free volume tuning the mechanical properties of metallic glass through ion irradiation

Y.H. Qiu; C. Xu; E.G. Fu; Pingzhang Wang; J.L. Du; Z.Y. Hu; X.Q. Yan; Xingzhong Cao; Yugang Wang; L. Shao

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