J. P. Bergman

Mechanism for low-temperature photoluminescence in GaNAs/GaAs structures grown by molecular-beam epitaxy

The mechanism for low-temperature photoluminescence (PL) emissions in GaNAs epilayers and GaAs/GaNxAs1 - x quantum well (QW) structures grown by molecular-beam epitaxy is studied in detail, employ ...

Deep level defects in electron-irradiated 4H SiC epitaxial layers

Deep level defects in electron-irradiated 4H SiC epitaxial layers grown by chemical vapor deposition were studied using deep level transient spectroscopy. The measurements performed on electron-irradiated p+n junctions in the temperature range 100–750 K revealed several electron traps and one hole trap with thermal ionization energies ranging from 0.35 to 1.65 eV. Most of these defects were already observed at a dose of irradiation as low as ≈5×1013 cm-2. Dose dependence and annealing behavior of the defects were investigated. For two of these electron traps, the electron capture cross section was measured. From the temperature dependence studies, the capture cross section of these two defects are shown to be temperature independent.

Electrically active defects in n-type 4H-silicon carbide grown in a vertical hot-wall reactor

We have studied intrinsic and impurity related defects in silicon carbide (SiC) epilayers grown with fast epitaxy using chemical vapor deposition in a vertical hot-wall reactor. Using capacitance transient techniques, we have detected low concentrations of electron traps (denoted as Z1/2, EH6/7 and titanium) and hole traps (denoted as HS1 and shallow boron) in the n-type 4H–SiC epilayers. The concentration of intrinsic defects (Z1/2, EH6/7, and HS1 centers) increases with increasing growth temperature. The incorporation of shallow boron (B) decreases at higher growth temperatures, whereas the titanium (Ti) concentration is not sensitive to the growth temperature. The concentration of shallow B and Ti increases with increasing C/Si ratio. The concentration of the EH6/7 and the HS1 centers however, decreases with increasing C/Si ratio. We have also tested graphite susceptors with TaC or SiC coating and observed that the purity of the susceptor material plays a critical role in reducing the background impuri...

A 4.5 kV 6H silicon carbide rectifier

Reactive ion etched silicon carbide mesa pin diodes with voltage blocking capabilities as high as 4.5 kV have been fabricated from 6H–SiC epitaxial layers. The epitaxial structure was grown by chemical vapor deposition on an n+ substrate giving a low‐doped 45 μm thick n− active base layer and a 1.5 μm thick high‐doped p+ emitter layer on top. A high minority carrier lifetime of 0.43 μs in the n− active base layer provides good on‐state properties with a typical forward voltage drop of 6 V at 100 A/cm2.

Growth of SiC by "Hot-Wall" CVD and HTCVD

A reactor concept for the growth of high-quality epitaxial SiC films has been investigated. The reactor concept is based on a hot-wall type susceptor which, due to the unique design, is very power efficient. Four different susceptors are discussed in terms of quality and uniformity of the grown material. The films are grown using the silane–propane–hydrogen system on off-axis (0001) 6H- and 4H-SiC substrates. Layers with doping levels in the low 1014 cm—3 showing strong free exciton emission in the photoluminescence spectra may readily be grown reproducibly in this system. The quality of the grown layers is also confirmed by the room temperature minority carrier lifetimes in the microsecond range and the optically detected cyclotron resonance data which give mobilities in excess of 100000 cm2/Vs at 6 K. Finally, a brief description will be given of the HTCVD technique which shows promising results in terms of high quality material grown at high growth rates.

Growth and excitonic properties of single fractional monolayer CdSe/ZnSe structures

Single fractional monolayer (FM) CdSe/ZnSe structures have been grown by molecular beam epitaxy (MBE), employing both conventional MBE and migration-enhanced epitaxy (MEE). A precise calibration of the FM mean thickness in the range of 0.15–3.0 ML has been performed for both techniques, revealing more than a 3.5 times lower Cd incorporation ability for the MEE mode at the same Cd and Se incident fluxes. Steady-state and time-resolved photoluminescence spectroscopy is used to characterize the intrinsic morphology of the CdSe FMs, with a special emphasis on the submonolayer thickness range. Both MBE and MEE grown samples exhibit inhomogeneity of the excitonic system, which can be explained by coexistence of a homogeneous alloylike layer and relatively large CdSe 2D clusters. The MEE samples display smaller fluctuations of the layer thickness and island sizes.

Mechanism for rapid thermal annealing improvements in undoped GaNxAs1−x/GaAs structures grown by molecular beam epitaxy

A systematic investigation of the effect of rapid thermal annealing (RTA) on optical properties of undoped GaNAs/GaAs structures is reported. Two effects are suggested to account for the observed dramatic improvement in the quality of the GaNxAs1−x/GaAs quantum structures after RTA: (i) improved composition uniformity of the GaNxAs1−x alloy, deduced from the photoluminescence (PL), PL excitation and time-resolved measurements; and (ii) significant reduction in the concentration of competing nonradiative defects, revealed by the optically detected magnetic resonance studies.

Luminescence from stacking faults in 4H SiC

A previously unreported photoluminescence spectrum observed in certain 4H SiC bipolar diodes after extended forward voltage operation is reported. We assign this emission to exciton recombination at local potential fluctuations caused by stacking faults, which are created during operation of the diodes. Possible recombination mechanisms responsible for the spectrum are discussed.

Dislocation evolution in 4H-SiC epitaxial layers

4H-SiC commercial wafers and sublimation grown epitaxial layers with a thickness of 100 μm have been studied concerning crystalline structure. The substrates and the epitaxial layers have been separately investigated by high-resolution x-ray diffraction and synchrotron white beam x-ray topography. The results show that the structural quality was improved in the epitaxial layers in the [1120] and [1100] directions, concerning domain distribution, lattice plane misorientation, mosaicity, and strain, compared with the substrates. Misoriented domains have merged together to form larger domains while the tilt between the domains was reduced, which resulted in nonsplitting in diffraction curves. If the misorientation in the substrate is large, we can only see a slight decrease in the misorientation in the epilayer. At some positions on the substrates block structures (mosaicity) were observed. ω-rocking curves showed smaller full width at half maximum values and more uniform and narrow peaks, while the curvat...

Properties and origins of different stacking faults that cause degradation in SiC PiN diodes

The electrical degradation of 4H–SiC PiN diodes has recently attracted much interest and is a critical material problem for high power applications. The degradation is caused by stacking faults observed as an increased forward voltage drop after forward injection operation. In this article we have combined electrical, optical, and structural techniques to study the formation and growth of the stacking faults causing degradation. We will show three different sources causing two different types of stacking fault properties.