J. Pstruś

Surface tension of liquid Ag-Sn alloys: Experiment versus modeling

The maximum bubble pressure method has been used to measure the surface tension of pure tin and seven binary alloys with concentrations of 15, 30, 40, 60, 75, 87.8, and 96.2 at.% Sn. Measurements were performed at the temperature range from 500 to about 1400 K depending on the composition of the investigated alloy. Densities of the Ag-Sn alloys were measured dilatometrically. The linear dependencies of densities and surface tensions on temperature were observed, and they are described by a straight-line equation.

Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance -ANOVA

Purpose – The purpose of this paper is a comparable evaluation of the influence of a particular element (Bi and Sb) added to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface and interfacial tensions, as well as the wetting properties on the Cu substrate expressed by the wetting angle.Design/methodology/approach – The authors applied the L8 orthogonal Taguchi array to carry out the experiments and discussed the results using analysis of variance (ANOVA).Findings – It was expected, on the base of previous studies, the decrease of the surface and interfacial tensions and thus improving wettability after the Bi and Sb addition to Sn‐Ag‐Cu and Sn‐Zn alloys. Unfortunately, the obtained results on the quinary Sn‐Ag‐Cu‐Bi‐Sb alloys and the quaternary Sn‐Zn‐Bi‐Sb alloys do not confirm these trends. The performed analyses suggest that the compositions of the quinary Sn‐Ag‐Cu‐Bi‐Sb alloys, as well as the quaternary Sn‐Zn‐Bi‐Sb alloys, do not have optimal compositions for practical application. The Cu, Bi and Sb elements i...

Pb-Free solders: Part II. Application of ADAMIS database in modeling of Sn−Ag−Cu alloys with Bi additions

The ADAMIS database was used for calculation of the surface tension of the quaternary Sn−Ag−Cu−Bi liquid alloys by Butlers model. The resultant data were compared with those from the maximum bubble pressure measurements from Part I. The same thermodynamic database was next applied for the calculation of various phase equilibria. It was established that the Bi addition to the ternary Sn−Ag−Cu alloys (Sn-2.6Ag-0.46Cu and Sn-3.13Ag-0.74Cu in at.%; Sn-2.56Ag-0.26 Cu and Sn-2.86Ag-O.40Cu in mass%) causes lowering of the melting temperature and the surface tension to make the tested alloys closer to, traditional Sn−Pb solders. The simulation of the solidification by Scheils model showed that the alloys with the higher Bi concentration are characterized by the lifting-off failure due to the segregation of Bi at the solder/substrate boundary. Thus, in modeling of new Pb-free solders, a compromise among various properties should be taken into consideration.

Investigation of Sn‐Zn‐Bi solders – Part I: surface tension, interfacial tension and density measurements of SnZn7Bi solders

Purpose – The purpose of Part I of this paper is to investigate the influence of Bi additions on the surface tension, the interfacial tension, and the density of SnZn7Bi alloys (Bi=1 and 3 percent by mass) as a continuation of similar previous studies on Bi and Sb additions to the binary Sn‐Zn alloy. The main aim of Part I is to indicate that the lowering of the surface tension and interfacial tension is not sufficient for practical applications. However, knowledge of the interfacial tension between the soldering flux and the solder is necessary to convert the wetting force into the contact angle. This will be documented in Part II.Design/methodology/approach – The maximum bubble method was applied for the surface tension and the Miyazaki method was applied for the surface tension and the interfacial tension, using the density values from the dilatometric technique. The experimental surface tension results are compared with the Butlers thermodynamic modeling results and are discussed by means of the anal...

Densities of solid aluminum-magnesium (Al-Mg) alloys

Densities of solid Al and Al-Mg alloys were measured by the dilatometric method for seven compositions at mole fractions of magnesium: 0.015, 0.05, 0.1, 0.125, 0.15, 0.20, and 0.25. A curvilinear dependence of density on temperature (room temperature up to 800 K) was observed for all investigated alloys. Results are described by polynomials of the second degree. The molar volumes of Al-Mg alloys were calculated from the density measurements. It has been found that the densities of solid Al-Mg alloys show negative deviations from linearity and the molar volumes exhibit positive deviations from ideal behavior for all samples in the experimental concentration range. The density of the β(Al3Mg2) phase along the (α(Al) + β)/β boundary was calculated and is described by a temperature-dependent polynomial.

Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method

Purpose – The purpose of this paper is to investigate the influence of Bi additions on the wetting properties of SnZn7Bi alloys (Bi=1 and 3 per cent by mass) on a copper substrate and printed circuit boards (PCBs) with lead‐free finishes (SnCu, immersion Sn, Ni/Au, organic solderability preservative) in the presence of fluxes. The practical implications of the results is the main purpose of these investigations.Design/methodology/approach – A wetting balance method was used for wetting measurements at 230 and 250°C in nitrogen and air atmospheres in the presence of ORM0‐ or ROL0‐type fluxes. The PCBs were investigated ‘as received’ and after accelerated aging. The analysis of variance (ANOVA) analysis was performed in order to explain how the main factors of the experiments (the Bi content in the alloy (1 or 3 per cent), the test temperature and the test atmosphere) influenced the wetting ability of SnZn7Bi on Cu substrates.Findings – As expected, a higher temperature and a higher Bi content in the alloy ...

Densities and molar volumes of solid lithium-magnesium (Li-Mg) alloys

Densities of solid Mg and Li-Mg alloys were measured for five compositions of mole fractions of Li equal to 0.05,0.1,0.15,0.20, and 0.25, respectively, by the dilatometric method. The curvilinear dependence of the density on temperature (room temperature up to 873 K) was observed for all investigated alloys. Results could be described by parabolic equations. The molar volumes of Li-Mg alloys were calculated from the density measurements. It has been found that the densities of solid Li-Mg alloys show positive deviations from linearity, and the molar volumes exhibit negative deviations from linear dependence for all samples in the experimental concentration range. It was possible to describe the dependence of density on temperature and concentration by a polynomial. Coefficients of thermal expansion were calculated and discussed. The density of the (Li) phase along the (Li)/[(Mg) + (Li)] boundary was calculated and described by a temperature-dependent polynomial of the third power.