James Edward Simpson
General Electric
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by James Edward Simpson.
Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes | 2013
Bill Burdick; Jeff Erlbaum; Kaustubh Ravindra Nagarkar; Brian David Yanoff; Liang Yin; Raj Bahadur; Esmaeil Heidari; Donna Marie Sherman; James Edward Simpson
Cadmium Zinc Telluride (CZT) based radiation detectors have been developed over the past decade and are, increasingly, being used in security and healthcare applications. Improvements in radiation detector performance, size, and cost have been achieved; however, the manufacturability and reliability of the individual CZT detector package continues to limit widespread use and new applications.To date, most CZT detector packages are designed, manufactured, and tested to requirements defined by manufacturers, rather than military, commercial, or industry standards, as is common for semiconductor packages. The lack of test standards has led to use restrictions and/or complex detector system design, as required to mitigate unknown or low detector package reliability. CZT detector packaging, as was the case for semiconductor packaging, has reached the point in technology maturation where a focus on optimizing detector design for manufacturability and reliability is appropriate and necessary.This paper reviews the systematic approach, including design, process development, and testing, utilized in the development and demonstration of a highly manufacturable and reliable (95% reliability at 1000 cycles) CZT detector package. Finite Element Model (FEM) based design and material trade-off studies, development of highly manufacturable and reliable commercial electronic assembly processes, failure mode identification and mitigation, selection and use of reliability test standards, and analyses are detailed for a flip-chip-CZT-on-ceramic substrate, detector package targeted for field deployment. As well, the next steps in package and system design, manufacturing, and reliability testing are proposed.Copyright
Archive | 2002
Colin Richard Wilson; Mark Ernest Vermilyea; James Edward Simpson
Archive | 2002
Paul Michael Ratzmann; Suryaprakash Ganti; Mark Ernest Vermilyea; James Edward Simpson
Archive | 2004
James Edward Simpson; Hector Manuel Rodriguez; Mark Ernest Vermilyea; Maria Mercedes Otero; Brian Lounsberry
Archive | 2008
Mark Ernest Vermilyea; James Edward Simpson
Archive | 2013
William Dwight Gerstler; James Edward Simpson; Laura Michele Hudy; Vaibhav Bahadur; Chiranjeev Kalra
Archive | 2005
James Edward Simpson; Hector Manuel Rodriguez; Mark Ernest Vermilyea; Maria Mercedes Otero; Brian Douglas Lounsberry
Archive | 2003
Suryaprakash Ganti; Paul Michael Ratzmann; James Edward Simpson; Mark Ernest Vermilyea; ジェームズ・エドワード・シンプソン; スルヤプラカシ・ガンティ; ポール・マイケル・ラッツマン; マーク・アーネスト・ベルミリア
ASME 2010 International Mechanical Engineering Congress and Exposition | 2010
Raymond T. Lueg; James Wilson Rose; James Edward Simpson
Archive | 2003
Paul Michael Ratzmann; Suryaprakash Ganti; Mark Ernest Vermilyea; James Edward Simpson