James M. Lorenzo

Thermal management of electronic components using Makrolon polycarbonate and Bayflex polyurethane

Thermal energy of many electronic components is currently managed using a heat sink cast of a conductive metal alloy. This method requires significant secondary assembly of many sub-components such as fasteners, thermal interface materials and potting compounds. A unique combination of thermally conductive polycarbonate, insulating polyurethane, in-mold electronic component assembly and encapsulation reduces the number of components while creating a finished part in a mold without the need for manual assembly. The benefits vs. traditional manufacturing are reduction in labor cost, increased supplier competition and improved thermal performance through the elimination of thermal interface materials (TIM). In-mold bonding of the printed circuit board (PCB) to the polycarbonate can reduce steady state temperature by creating solid thermal paths eliminating TIM resistance [1]. A second step using polyurethane encapsulation of other PCBs such as driver boards in the assembly replaces the current potting step necessary in some components. A fully automated integrated work cell utilizing the in mold encapsulation technique has the potential to help LED luminaire manufacturers achieve a lower price to market and streamline manufacturing of electronics designs needing passive thermal management.