James S. Papanu

DICING PROCESSES FOR THIN WAFERS WITH BUMPS ON WAFER BACKSIDE

Maskless hybrid laser scribing and plasma etching wafer dicing process

SCREEN PRINT MASK FOR LASER SCRIBE AND PLASMA ETCH WAFER DICING PROCESS

Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance

HYBRID WAFER DICING APPROACH USING TEMPORALLY-CONTROLLED LASER SCRIBING PROCESS AND PLASMA ETCH

BAKING TOOL FOR IMPROVED WAFER COATING PROCESS

HYBRID WAFER DICING APPROACH USING A SPLIT BEAM LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS

UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach

IMPROVED WAFER COATING

Hybrid wafer dicing approach using collimated laser scribing process and plasma etch