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James S. Papanu

Eaton Corporation

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Publication

Featured researches published by James S. Papanu.

Archive | 2014

DICING PROCESSES FOR THIN WAFERS WITH BUMPS ON WAFER BACKSIDE

Wei-Sheng Lei; James S. Papanu; Aparna Iyer; Brad Eaton; Ajay Kumar

Archive | 2014

Maskless hybrid laser scribing and plasma etching wafer dicing process

Wei-Sheng Lei; Brad Eaton; James S. Papanu; Ajay Kumar

Archive | 2013

SCREEN PRINT MASK FOR LASER SCRIBE AND PLASMA ETCH WAFER DICING PROCESS

Prabhat Kumar; Brad Eaton; Wei-Sheng Lei; James S. Papanu; Ajay Kumar

Archive | 2014

Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance

Wei-Sheng Lei; Brad Eaton; Ajay Kumar; James S. Papanu; Jungrae Park

Archive | 2015

HYBRID WAFER DICING APPROACH USING TEMPORALLY-CONTROLLED LASER SCRIBING PROCESS AND PLASMA ETCH

Jungrae Park; Wei-Sheng Lei; James S. Papanu; Brad Eaton; Ajay Kumar

Archive | 2014

BAKING TOOL FOR IMPROVED WAFER COATING PROCESS

Jungrae Park; Wei-Sheng Lei; James S. Papanu; Brad Eaton; Ajay Kumar

Archive | 2017

HYBRID WAFER DICING APPROACH USING A SPLIT BEAM LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS

Jungrae Park; Wei-Sheng Lei; Brad Eaton; James S. Papanu; Ajay Kumar

Archive | 2015

UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach

Wei-Sheng Lei; Brad Eaton; Jungrae Park; Ajay Kumar; James S. Papanu; Prabhat Kumar

Archive | 2015

IMPROVED WAFER COATING

Jungrae Park; Wei-Sheng Lei; Prabhat Kumar; James S. Papanu; Brad Eaton; Ajay Kumar

Archive | 2014

Hybrid wafer dicing approach using collimated laser scribing process and plasma etch

Jungrae Park; Wei-Sheng Lei; James S. Papanu; Brad Eaton; Ajay Kumar

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Ajay Kumar

Eaton Corporation

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Brad Eaton

Eaton Corporation

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Wei-Sheng Lei

Eaton Corporation

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Jungrae Park

Eaton Corporation

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Prabhat Kumar

Eaton Corporation

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Aparna Iyer

Eaton Corporation

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