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Dive into the research topics where Jan G. Korvink is active.

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Featured researches published by Jan G. Korvink.


Journal of Materials Chemistry | 2010

Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

Jolke Perelaer; Patrick J. Smith; Dario Mager; Daniel Soltman; Steven K. Volkman; Vivek Subramanian; Jan G. Korvink; Ulrich S. Schubert

Printed electronics represent an emerging area of research that promises large markets due to the ability to bypass traditional expensive and inflexible silicon-based electronics to fabricate a variety of devices on flexible substrates using high-throughput printing approaches. This article presents a summary of work to date in the field of printed electronics and the materials chemistry involved. In particular, the focus is upon the use of metal- and metal oxide-containing inks in the preparation of contacts and interconnects. The review discusses the challenges associated with processing these types of inks and ways to successfully obtain the desired features.


Magnetic Resonance Materials in Physics Biology and Medicine | 2008

Parallel imaging in non-bijective, curvilinear magnetic field gradients: a concept study.

Jürgen Hennig; Anna Welz; Gerrit Schultz; Jan G. Korvink; Zhenyu Liu; Oliver Speck; Maxim Zaitsev

ObjectivesThe paper presents a novel and more generalized concept for spatial encoding by non-unidirectional, non- bijective spatial encoding magnetic fields (SEMs). In combination with parallel local receiver coils these fields allow one to overcome the current limitations of neuronal nerve stimulation. Additionally the geometry of such fields can be adapted to anatomy.Materials and methodsAs an example of such a parallel imaging technique using localized gradients (PatLoc)- system, we present a polar gradient system consisting of 2 × 8 rectangular current loops in octagonal arrangement, which generates a radial magnetic field gradient. By inverting the direction of current in alternating loops, a near sinusoidal field variation in the circumferential direction is produced. Ambiguities in spatial assignment are resolved by use of multiple receiver coils and parallel reconstruction. Simulations demonstrate the potential advantages and limitations of this approach.Results and conclusionsThe exact behaviour of PatLoc fields with respect to peripheral nerve stimulation needs to be tested in practice. Based on geometrical considerations SEMs of radial geometry allow for about three times faster gradient switching compared to conventional head gradient inserts and even more compared to whole body gradients. The strong nonlinear geometry of the fields needs to be considered for practical applications.


Archive | 2006

MEMS : a practical guide to design, analysis, and applications

Jan G. Korvink; Oliver Paul

Microtransducer Operation.- Material Properties: Measurement and Data.- MEMS and NEMS Simulation.- System-Level Simulation of Microsystems.- Thermal-Based Microsensors.- Photon Detectors.- Free-Space Optical MEMS.- Integrated Micro-Optics.- Microsensors for Magnetic Fields.- Mechanical Microsensors.- Semiconductor-Based Chemical Microsensors.- Microfluidics.- Biomedical Systems.- Microactuators.- Micromachining Technology.- LIGA Technology for R&D and Industrial Applications.- 17 Interface Circuitry and Microsystems.


Journal of Micromechanics and Microengineering | 2010

A fully MEMS-compatible process for 3D high aspect ratio micro coils obtained with an automatic wire bonder

K. Kratt; Vlad Badilita; Tobias Burger; Jan G. Korvink; Ulrike Wallrabe

We report the fabrication of 3D micro coils made with an automatic wire bonder. Using standard MEMS processes such as spin coating and UV lithography on silicon and Pyrex® wafers results in high aspect ratio SU-8 posts with diameters down to 100 µm that serve as mechanical stabilization yokes for the coils. The wire bonder is employed to wind 25 µm insulated gold wire around the posts in an arbitrary (e.g. solenoidal) path, yielding arrays of micro coils. Each micro coil is bonded directly on-chip, so that loose wire ends are avoided and, compared to other winding methods, coil re-soldering is unnecessary. The manufacturing time for a single coil is about 200 ms, and although the process is serial, it is batch fabrication compatible due to the high throughput of the machine. Despite the speed of manufacture we obtain high manufacturing precision and reliability. The micro air-core solenoids show an RF quality factor of over 50 when tested at 400 MHz. We present a flexible coil making method where the number of windings is only limited by the post height. The coil diameter is restricted by limits defined by lithography and the mechanical strength of the posts. Based on this technique we present coils ranging from 100 µm diameter and 1 winding up to 1000 µm diameter and 20 windings.


Journal of Micromechanics and Microengineering | 2005

Efficient optimization of transient dynamic problems in MEMS devices using model order reduction

Jeong Sam Han; Evgenii B. Rudnyi; Jan G. Korvink

One of the main obstacles to including transient dynamic effects into the performance functions of a structural optimization for microelectromechanical systems (MEMS) is the high computational cost of each time-dependent response simulation. This paper focuses on the application of model order reduction techniques to optimal design so as to reduce the transient analysis time for the optimization process. To do this, our open-source software mor4ansys performs model order reductions via the block Arnoldi algorithm directly to ANSYS finite element models. We adopt a micro accelerometer as an example to demonstrate the advantages of this approach. The harmonic and transient results of a reduced-order model of the accelerometer yield very good agreement with that from the original high-dimensional ANSYS model. The use of reduced-order models within the optimization iterations produces almost the same results as those without model order reduction, and speeds up the total computation by at least an order of magnitude.


Journal of Micromechanics and Microengineering | 2013

Unconventional applications of wire bonding create opportunities for microsystem integration

Andreas Fischer; Jan G. Korvink; Niclas Roxhed; Göran Stemme; Ulrike Wallrabe; Frank Niklaus

Automatic wire bonding is a highly mature, cost-efficient and broadly available back-endprocess, intended to create electrical interconnections in semiconductor chip packaging. Modern production wi ...


Nature Communications | 2013

A hyperpolarized equilibrium for magnetic resonance.

Jan-Bernd Hövener; Niels Schwaderlapp; Thomas Lickert; Simon B. Duckett; Ryan E. Mewis; Louise A. R. Highton; Kenny Sm; Gary G. R. Green; Dieter Leibfritz; Jan G. Korvink; Jürgen Hennig; von Elverfeldt D

Nuclear magnetic resonance spectroscopy and imaging (MRI) play an indispensable role in science and healthcare but use only a tiny fraction of their potential. No more than ≈10 p.p.m. of all 1H nuclei are effectively detected in a 3-Tesla clinical MRI system. Thus, a vast array of new applications lays dormant, awaiting improved sensitivity. Here we demonstrate the continuous polarization of small molecules in solution to a level that cannot be achieved in a viable magnet. The magnetization does not decay and is effectively reinitialized within seconds after being measured. This effect depends on the long-lived, entangled spin-order of parahydrogen and an exchange reaction in a low magnetic field of 10−3 Tesla. We demonstrate the potential of this method by fast MRI and envision the catalysis of new applications such as cancer screening or indeed low-field MRI for routine use and remote application.


Journal of Micromechanics and Microengineering | 2005

Dynamic electro-thermal simulation of microsystems—a review

Tamara Bechtold; Evgenii B. Rudnyi; Jan G. Korvink

An overview of electro-thermal modeling of microsystems is presented. We consider the most important coupling between thermal and electrical phenomena, and then focus on the industrys central concern, that of Joule heating. A description of different solution approaches for the heat transfer partial differential equation, which constitutes the central part of electro-thermal simulation, is given. We briefly review the analytical solutions and consider further the numerical approaches, which are based on spatial discretization of the thermal domain. Lastly, we describe the final level of approximation, the dynamic compact thermal modeling. We emphasize the formal model order reduction methods, because they directly follow the spatial discretization, and thus preserve the investment into the finite element modeling.


parallel computing | 2004

Model order reduction for large scale engineering models developed in ANSYS

Evgenii B. Rudnyi; Jan G. Korvink

We present the software mor4ansys that allows engineers to employ modern model reduction techniques to finite element models developed in ANSYS. We focus on how one extracts the required information from ANSYS and performs model reduction in a C++ implementation that is not dependent on a particular sparse solver. We discuss the computational cost with examples related to structural mechanics and thermal finite element models.


Applied Physics Letters | 2009

Terahertz metamaterials fabricated by inkjet printing

Markus Walther; Alex Ortner; Henning Meier; Ute Löffelmann; Patrick J. Smith; Jan G. Korvink

Metamaterial layers designed for gigahertz to terahertz (THz)-frequencies have been fabricated by inkjet printing. The spectral response of the structures consisting of periodically arranged metallic split-ring resonators is characterized by THz-time-domain spectroscopy and compared with identical structures produced by conventional photolithography and etching techniques. The broader linewidth of their resonances is shown to originate mainly from structural inhomogeneities. Our study shows that inkjet printing is a viable route for producing metamaterial structures, allowing for rapid processing and flexibility in the choice of substrates.

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Dario Mager

Karlsruhe Institute of Technology

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Vlad Badilita

Karlsruhe Institute of Technology

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Zhenyu Liu

Chinese Academy of Sciences

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