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Dive into the research topics where Janusz Bryzek is active.

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Featured researches published by Janusz Bryzek.


IEEE Circuits & Devices | 2006

Marvelous MEMs: Advanced IC sensors and microstructures for high volume applications

Janusz Bryzek; Shad Roundy; Brian Bircumshaw; Charles Chung; Kenneth Castellino; Joseph R. Stetter; Michael Vestel

Microelectromechanical systems (MEMS) are a foundation for a broad range of mechanical, chemical, optical, and biotech products (sensors, microstructures and actuators) fabricated as integrated circuits on (primarily) silicon wafers in a batch mode. Commercial MEMS products include pressure sensors, acceleration sensors, gyros, ink-jet nozzles, read-write head positioners in hard drives, and digital light processors (DLPs) in projectors and television sets. The first four decades of MEMS development created a US


IEEE Circuits & Devices | 2006

Marvelous MEMS

Janusz Bryzek; Shad Roundy; Brian Bircumshaw; C. Chung; K. Castellino; Joseph R. Stetter; Michael Vestel

8 billion market. During the next decade, the MEMS market is estimated to increase by US


Archive | 2011

MICROELECTROMECHANICAL PRESSURE SENSOR INCLUDING REFERENCE CAPACITOR

Janusz Bryzek

32 billion. Based on the presented overview of emerging MEMS sensors and microstructures, such a magnitude of growth is definitely possible.


Archive | 2011

Sealed packaging for microelectromechanical systems

Janusz Bryzek; John Gardner Bloomsburgh; Cenk Acar


Archive | 2011

Packaging to reduce stress on microelectromechanical systems

Janusz Bryzek; John Gardner Bloomsburgh; Cenk Acar


Archive | 2010

Micromachined devices and fabricating the same

David Lambe Marx; Cenk Acar; Sandeep Akkaraju; Janusz Bryzek


Archive | 2011

Multi-die mems package

Janusz Bryzek; John Gardner Bloomsburgh; Cenk Acar


Archive | 2011

Inertial sensor mode tuning circuit

Janusz Bryzek


Archive | 2011

Through silicon via with reduced shunt capacitance

Janusz Bryzek; John Gardner Bloomsburgh; Cenk Acar


Archive | 2013

Through silicon via including multi-material fill

David Lambe Marx; Brian Bircumshaw; Janusz Bryzek

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