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Jay A. Yoder

Publication

Featured researches published by Jay A. Yoder.

Archive | 2002

Semiconductor device and laminated leadframe package

James P. Letterman; Joseph K. Fauty; Jay A. Yoder

Archive | 2005

Method of forming a leaded molded array package

William F. Burghout; Francis J. Carney; Joseph K. Fauty; James P. Letterman; Jay A. Yoder

Archive | 2004

Multi-chip semiconductor connector assemblies

Francis J. Carney; Phillip Celaya; Joseph K. Fauty; James P. Letterman; Stephen St. Germain; Jay A. Yoder

Archive | 2004

ELECTRONIC PACKAGE HAVING DOWN-SET LEADS AND METHOD

James P. Letterman; Joseph K. Fauty; Jay A. Yoder; William F. Burghout

Archive | 2007

Multi-chip semiconductor connector and method

Francis J. Carney; Phillip Celaya; Joseph K. Fauty; James P. Letterman; Stephen St. Germain; Jay A. Yoder

Archive | 2004

Multi-chip semiconductor connector assembly method

Francis J. Carney; Phillip Celaya; Joseph K. Fauty; James P. Letterman; Stephen St. Germain; Jay A. Yoder

The International journal of microcircuits and electronic packaging | 2002

Mold compound adhesion to bare copper lead frames: Effect of laser texturing

Joseph K. Fauty; James Knapp; Jay A. Yoder

The International journal of microcircuits and electronic packaging | 2001

Al-Cu metal bond pad corrosion during wafer saw

Joseph K. Fauty; Steve Strouse; Jay A. Yoder; Carlos Acuna; Phil Evard

Archive | 2003

Method of marking a low profile packaged semiconductor device

James H. Knapp; Jay A. Yoder; Harold G. Anderson

Archive | 2017

SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

Stephen St. Germain; Roger M. Arbuthnot; Jay A. Yoder; Dennis Lee Conner

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