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Dive into the research topics where Jaynal Abedin Molla is active.

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Electrochimica Acta | 1991

THE EFFECT OF PH ON THE ELECTROCATALYTIC PROPERTIES OF ADSORBED METAL IONS

Perminder Singh Bindra; David Noel Light; Jaynal Abedin Molla

The electrocatalytic behavior of adsorbed lead atoms on mercury towards O2 reduction in neutral electrolyte at ambient temparature is examined. The results shows that O2 reduction on these modified surfaces proceeds through the series mechanism and that the enhancement is mainly due to hydrogen peroxide elimination through reduction and/or heterogeneous chemical decomposition. Measurements performed as a function of pH in the range pH = 4 to pH = 10 indicate that the hydrogen peroxide decomposition reaction slows down as the pH increases. Using cyclic voltammetry and rotating ring-disk techniques, it is demonstrated that for the PbHg system the catalytic species is lead oxide or lead hydroxide.


Archive | 1994

Interconnection method and structure for organic circuit boards

Perminder Singh Bindra; Ross Downey Havens; Voya R. Markovich; Jaynal Abedin Molla


Archive | 1991

Method of fabricating nendritic materials

Perminder Singh Bindra; J. J. Cuomo; Thomas P. Gall; Anthony P. Ingraham; Sung K. Kang; Jungihl Kim; Paul A. Lauro; David Noel Light; Voya R. Markovich; Ekkehard F. Miersch; Jaynal Abedin Molla; Douglas O. Powell; John J. Ritsko; George J. Saxenmeyer; Jack A. Varcoe; George Frederick Walker


Archive | 1990

Separable electrical connection technology

Perminder Singh Bindra; J. J. Cuomo; Thomas P. Gall; Anthony P. Ingraham; Sung K. Kang; Jungihl Kim; Paul A. Lauro; David Noel Light; Voya R. Markovich; Ekkehard F. Miersch; Jaynal Abedin Molla; Douglas O. Powell; John J. Ritsko; George J. Saxenmeyer; Jack A. Varcoe; George Frederick Walker


Archive | 1993

Method of forming a conductive end portion on a flexible circuit member

Raymond Archie Busacco; Fletcher William Chapin; David William Dranchak; Jaynal Abedin Molla; George J. Saxenmeyer; Robert David Topa


Archive | 1996

Selectively filled adhesives for semiconductor chip interconnection and encapsulation

Michael A. Gaynes; Jaynal Abedin Molla; Steven P. Ostrander; Judith Marie Roldan; George J. Saxenmeyer; George Frederick Walker


Archive | 1997

Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate

Michael A. Gaynes; Jaynal Abedin Molla


Archive | 2000

Method and apparatus for in-situ testing of integrated circuit chips

Anilkumar Chinuprasad Bhatt; Leo Raymond Buda; Robert Douglas Edwards; Paul Joseph Hart; Anthony P. Ingraham; Voya R. Markovich; Jaynal Abedin Molla; Richard Gerald Murphy; George J. Saxenmeyer; George Frederick Walker; Bette Jaye Whalen; Richard Stuart Zarr


Archive | 1993

Method of solder bonding processor package

Raymond T. Galasco; Jaynal Abedin Molla


Archive | 1997

Selectively filled adhesives for compliant, reworkable, and solder-free flip chip interconnection and encapsulation

Michael A. Gaynes; Jaynal Abedin Molla

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