Jean M. Tancrede

Hot-melt adhesives

The invention provides a hot melt adhesive composition including a tubular reactor copolymer of ethylene and 5 to 20 mol % of comonomer units derived from an alkyl acrylate or alkyl methacrylate, wherein the copolymer has a melt index of at least 300 g/10 min. The alkyl group of the alkyl acrylate or alkyl methacrylate can be a linear or branched C1 to C12 group, particularly n-butyl. If desired, the hot melt adhesive can further include tackifiers, waxes, antioxidants and other desired additives. The hot melt adhesive composition shows improved heat resistance and favorable properties, such as has a shear adhesion fail temperature of at least 80° C., without the need to use high melting waxes. The invention further provides articles such as cartons, cases, trays, bookbindings or disposables including the hot melt adhesive compositions.