Jeehwan Kim

High Efficiency Cu2ZnSn(S,Se)4 Solar Cells by Applying a Double In2S3/CdS Emitter

High-efficiency Cu2ZnSn(S,Se)4 solar cells are reported by applying In2S3/CdS double emitters. This new structure offers a high doping concentration within the Cu2ZnSn(S,Se)4 solar cells, resulting in a substantial enhancement in open-circuit voltage. The 12.4% device is obtained with a record open-circuit voltage deficit of 593 mV.

Principle of direct van der Waals epitaxy of single-crystalline films on epitaxial graphene

There are numerous studies on the growth of planar films on sp(2)-bonded two-dimensional (2D) layered materials. However, it has been challenging to grow single-crystalline films on 2D materials due to the extremely low surface energy. Recently, buffer-assisted growth of crystalline films on 2D layered materials has been introduced, but the crystalline quality is not comparable with the films grown on sp(3)-bonded three-dimensional materials. Here we demonstrate direct van der Waals epitaxy of high-quality single-crystalline GaN films on epitaxial graphene with low defectivity and surface roughness comparable with that grown on conventional SiC or sapphire substrates. The GaN film is released and transferred onto arbitrary substrates. The post-released graphene/SiC substrate is reused for multiple growth and transfer cycles of GaN films. We demonstrate fully functional blue light-emitting diodes (LEDs) by growing LED stacks on reused graphene/SiC substrates followed by transfer onto plastic tapes.

Layer-Resolved Graphene Transfer via Engineered Strain Layers

Monolayer Graphene via Two Transfers Oriented monolayers of graphene containing some bilayer regions can be formed on silicon carbide crystal surfaces, but, to be cost effective, the graphene needs to be exfoliated and transferred to other substrates so that the silicon carbide crystal can be reused. Kim et al. (p. 833, published online 31 October) used a nickel film grown to a thickness designed to impart a particular surface stress as a “handle” to exfoliate the graphene layer for transfer to a silica substrate. An additional gold layer was then used to remove the excess monolayer from the bilayer regions to create a monolayer suitable for electronics applications. A two-step exfoliation process allows multiple transfers of oriented monolayer graphene from a silicon carbide surface. The performance of optimized graphene devices is ultimately determined by the quality of the graphene itself. Graphene grown on copper foils is often wrinkled, and the orientation of the graphene cannot be controlled. Graphene grown on SiC(0001) via the decomposition of the surface has a single orientation, but its thickness cannot be easily limited to one layer. We describe a method in which a graphene film of one or two monolayers grown on SiC is exfoliated via the stress induced with a Ni film and transferred to another substrate. The excess graphene is selectively removed with a second exfoliation process with a Au film, resulting in a monolayer graphene film that is continuous and single-oriented.

Three-Dimensional a-Si:H Solar Cells on Glass Nanocone Arrays Patterned by Self-Assembled Sn Nanospheres

We introduce a cost-effective method of forming size-tunable arrays of nanocones to act as a three-dimensional (3D) substrate for hydrogenated amorphous silicon (a-Si:H) solar cells. The method is based on self-assembled tin nanospheres with sizes in the range of 20 nm to 1.2 μm. By depositing these spheres on glass substrates and using them as an etch mask, we demonstrate the formation of glass nanopillars or nanocones, depending on process conditions. After deposition of 150 nm thick a-Si:H solar cell p-i-n stacks on the glass nanocones, we show an output efficiency of 7.6% with a record fill factor of ~69% for a nanopillar-based 3D solar cell. This represents up to 40% enhanced efficiency compared to planar solar cells and, to the best of our knowledge, is the first demonstration of nanostructured p-i-n a-Si:H solar cells on glass that is textured without optical lithography patterning methods.

Improved germanium n+/p junction diodes formed by coimplantation of antimony and phosphorus

Obtaining heavily-doped n-type germanium (Ge) is difficult since n-type dopant activation in Ge is limited to less than 5×1019 cm−3 which is far below the solid solubility limit of phosphorus (P) in Ge. Such poor activation has limited the rectifying properties of n+/p Ge diodes. This work is aimed at understanding the challenge of forming highly rectifying n+/p diode as well as enhancing rectification of n+/p diode by using antimony (Sb) and P coimplantation process. Enhanced n+ doping of greater than 1020 cm−3 in Ge obtained by Sb/P codoping results in enhanced rectification in Ge n+/p junction diode.Obtaining heavily-doped n-type germanium (Ge) is difficult since n-type dopant activation in Ge is limited to less than 5×1019 cm−3 which is far below the solid solubility limit of phosphorus (P) in Ge. Such poor activation has limited the rectifying properties of n+/p Ge diodes. This work is aimed at understanding the challenge of forming highly rectifying n+/p diode as well as enhancing rectification of n+/p diode by using antimony (Sb) and P coimplantation process. Enhanced n+ doping of greater than 1020 cm−3 in Ge obtained by Sb/P codoping results in enhanced rectification in Ge n+/p junction diode.

Remote epitaxy through graphene enables two-dimensional material-based layer transfer

Epitaxy—the growth of a crystalline material on a substrate—is crucial for the semiconductor industry, but is often limited by the need for lattice matching between the two material systems. This strict requirement is relaxed for van der Waals epitaxy, in which epitaxy on layered or two-dimensional (2D) materials is mediated by weak van der Waals interactions, and which also allows facile layer release from 2D surfaces. It has been thought that 2D materials are the only seed layers for van der Waals epitaxy. However, the substrates below 2D materials may still interact with the layers grown during epitaxy (epilayers), as in the case of the so-called wetting transparency documented for graphene. Here we show that the weak van der Waals potential of graphene cannot completely screen the stronger potential field of many substrates, which enables epitaxial growth to occur despite its presence. We use density functional theory calculations to establish that adatoms will experience remote epitaxial registry with a substrate through a substrate–epilayer gap of up to nine ångströms; this gap can accommodate a monolayer of graphene. We confirm the predictions with homoepitaxial growth of GaAs(001) on GaAs(001) substrates through monolayer graphene, and show that the approach is also applicable to InP and GaP. The grown single-crystalline films are rapidly released from the graphene-coated substrate and perform as well as conventionally prepared films when incorporated in light-emitting devices. This technique enables any type of semiconductor film to be copied from underlying substrates through 2D materials, and then the resultant epilayer to be rapidly released and transferred to a substrate of interest. This process is particularly attractive in the context of non-silicon electronics and photonics, where the ability to re-use the graphene-coated substrates allows savings on the high cost of non-silicon substrates.

Activation of Implanted n-Type Dopants in Ge Over the Active Concentration of 1 × 1020 cm − 3 Using Coimplantation of Sb and P

One of the greatest challenges in fabricating a Ge-channel n-MOSFET is achieving a high n-type dopant activation within the source and drain regions. Conventional approaches to increase the electrically active doping level have been proven to be unsatisfactory, and typically the highest activation of n-type dopants is 4 × 10 19 cm -3 using phosphorus. This article describes a method to enhance the activation level of n-type dopants in Ge. Coimplantation of phosphorus and antimony leads to dopant activation over 1 X 10 20 cm -3 at 500°C. The enhancement of n-type dopant activation is attributed to reducing the implantation damage upon annealing due to increase in solid solubility of the dopants.

Multiple implantation and multiple annealing of phosphorus doped germanium to achieve n-type activation near the theoretical limit

Full activation of n-type dopant in germanium (Ge) reaching to its solid solubility has never been achieved by using ion implantation doping technique. This is because implantation of dopants always leaves defects such as vacancy and interstitials in the Ge crystal. While implantation-induced defects are electrically neutral for the most of semiconductor materials, they are electrically positive for Ge resulting in compensation of n-type dopants. In this Letter, we verified that 5 × 1019 P/cm3 is the maximum active concentration, which can be fully activated in germanium “without leaving implantation damage” per implantation/annealing cycle. The repetition of implantation and annealing of phosphorous (P) with the concentration of 5 × 1019 cm−3 leads to the activation of 1 × 1020 P/cm3 close to its solid solubility limit of 2 × 1020 P/cm3.

Extremely Large Gate Modulation in Vertical Graphene/WSe2 Heterojunction Barristor Based on a Novel Transport Mechanism

A WSe2 -based vertical graphene-transition metal dichalcogenide heterojunction barristor shows an unprecedented on-current increase with decreasing temperature and an extremely high on/off-current ratio of 5 × 10(7) at 180 K (3 × 10(4) at room temperature). These features originate from a trap-assisted tunneling process involving WSe2 defect states aligned near the graphene Dirac point.

10.5% efficient polymer and amorphous silicon hybrid tandem photovoltaic cell

Thin-film solar cells made with amorphous silicon (a-Si:H) or organic semiconductors are considered as promising renewable energy sources due to their low manufacturing cost and light weight. However, the efficiency of single-junction a-Si:H or organic solar cells is typically <10%, insufficient for achieving grid parity. Here we demonstrate an efficient double-junction photovoltaic cell by employing an a-Si:H film as a front sub-cell and a low band gap polymer:fullerene blend film as a back cell on planar glass substrates. Monolithic integration of 6.0% efficienct a-Si:H and 7.5% efficient polymer:fullerene blend solar cells results in a power conversion efficiency of 10.5%. Such high-efficiency thin-film tandem cells can be achieved by optical management and interface engineering of fully optimized high-performance front and back cells without sacrificing photovoltaic performance in both cells.