Jens T. Darsell

Hierarchically Porous Graphitic Carbon with Simultaneously High Surface Area and Colossal Pore Volume Engineered via Ice Templating

Developing hierarchical porous carbon (HPC) materials with competing textural characteristics such as surface area and pore volume in one material is difficult to accomplish, particularly for an atomically ordered graphitic carbon. Herein we describe a synthesis strategy to engineer tunable HPC materials across micro-, meso-, and macroporous length scales, allowing the fabrication of a graphitic HPC material (HPC-G) with both very high surface area (>2500 m2/g) and pore volume (>11 cm3/g), the combination of which has not been attained previously. The mesopore volume alone for these materials is up to 7.53 cm3/g, the highest ever reported, higher than even any porous carbons total pore volume, which for our HPC-G material was >11 cm3/g. This HPC-G material was explored for use both as a supercapacitor electrode and for oil adsorption, two applications that require either high surface area or large pore volume, textural properties that are typically exclusive to one another. We accomplished these high textural characteristics by employing ice templating not only as a route for macroporous formation but as a synergistic vehicle that enabled the significant loading of the mesoporous hard template. This design scheme for HPC-G materials can be utilized in broad applications, including electrochemical systems such as batteries and supercapacitors, sorbents, and catalyst supports, particularly supports where a high degree of thermal stability is required.

Reactive Air Aluminizing of Nicrofer-6025HT for Use in Advanced Coal-Based Power Plants

Nicrofer-6025HT (Nicrofer) has been selected as a potential manifold material for advanced air separation units that use mixed ionic and electronic conductors (MIECs). Reactive air brazing (RAB) is a recently developed joining technique that has the potential to obtain high-quality joints with the required hermeticity between Nicrofer and the MIEC. Successful RAB joining of these two distinct materials requires an alumina surface layer on the Nicrofer. To aluminize the surface of Nicrofer, a recently developed reactive air aluminizing (RAA) technique was used. The current work demonstrated the feasibility of preparing RAA coatings on Nicrofer and compared the effect of aluminum powder size on the RAA process.

Hole-rich host materials for blue-phosphorescent OLEDs

Stable and efficient organic light emitting devices (OLEDs) are an integral part of the future of lighting and displays. The hole accumulation at the hole transport/emissive layer interface in such devices is considered to be a major pathway for degradation and efficiency loss. Here we report the design and synthesis of two charge-transporting host materials, based on the phosphine oxide (PO) moiety, engineered to improve hole transport of the emissive layer. The compounds are an extension of a molecular design strategy already explored and reported by our team which incorporates a hole transporting moiety and an electron transporting moiety. These novel materials were designed with two hole transport moieties (HTms) to further improve hole transport, compared to the first generation host materials that were designed with one hole transport functional group. The triplet exciton energy was maintained at a level greater than that of FIrpic (2.7 eV) to prevent exciton quenching. The EHOMO and ELUMO of the two classes of molecules (i.e., one HTm vs. 2 HTms) were similar, however their device performance varied greatly. Emission zone experiments were conducted to further understand the differences between molecules.

Simultaneous Independent Control of Tool Axial Force and Temperature in Friction Stir Processing

Maintaining consistent tool depth relative to the part surface is a critical requirement for many friction stir processing (FSP) applications. Force control is often used with the goal of obtaining a constant weld depth. When force control is used, if weld temperature decreases, flow stress increases and the tool is pushed up. If weld temperature increases, flow stress decreases and the tool dives. These variations in tool depth and weld temperature cause various types of weld defects. Robust temperature control for FSP maintains a commanded temperature through control of the spindle axis only. Robust temperature control and force control are completely decoupled in control logic and machine motion. This results in stable temperature, force and tool depth despite the presence of geometric and thermal disturbances. Performance of this control method is presented for various weld paths and alloy systems.